• Chip Package Signal

    Google (Sunnyvale, CA)
    …hardware experiences, delivering unparalleled performance, efficiency, and integration. As a Chip Package Signal and Power Integrity Engineer you will be ... responsible for the chip package design with signal / power integrity...team and vendors. You will drive chip packaging signal and power implementations… more
    Google (10/11/24)
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  • Analog Mixed- Signal Chip Lead…

    Lightmatter (Boston, MA)
    Analog Mixed- Signal Chip Lead Engineer Lightmatter builds chips that enable extreme-scale artificial intelligence computing clusters. If you're a collaborative ... daily norm. You will need both deep expertise in mixed- signal and analog design and breadth across other engineering...+ Collaborate with members of our design engineering teams ( packaging , digital, analog, photonics) to define chip more
    Lightmatter (09/30/24)
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  • Principal Mixed Signal IC Design Engineer

    RTX Corporation (Raleigh, NC)
    … ASIC/ROIC development activities with cross-functional teams including chip architecture, specification, design, verification, validation, fabrication, packaging ... signal chain, digital timing and image processing, and low- power 12 - 14 bit on- chip analog...processing, and low- power 12 - 14 bit on- chip analog to digital converters. + Collaborate in cross-functional… more
    RTX Corporation (10/26/24)
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  • Analog Mixed Signal Integrated Circuit…

    The Boeing Company (Huntington Beach, CA)
    …interfaces + Analog precision blocks such as Voltage/Current references, Temperature sensors, Signal conditioning channels + Power Management blocks such as ... for aerospace systems. SSED develops digital, analog, and RF Systems on Chip (SoCs) for radar, navigation, electronic warfare, communications, processing, and other… more
    The Boeing Company (10/17/24)
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  • Lead Signal Integrity Engineer - TPG

    Micron Technology, Inc. (Boise, ID)
    …multiple subject areas and organizations (eg, Signal Integrity, Circuit and Chip Design, Packaging R&D and System Integration). **Qualifications** + PhD w/5 ... engage in future performance scaling through sophisticated signaling techniques and package / channel improvement, including circuit power reduction, data… more
    Micron Technology, Inc. (10/12/24)
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  • Staff RF/Analog Mixed- Signal IC Design…

    Northrop Grumman (Linthicum, MD)
    …(IC) Design Engineers to join our team in the design and layout of custom, low- power , RF, analog and mixed signal circuits. The ideal candidate will have ... extraction for a variety of RF, analog and mixed signal circuits. The right candidate will be comfortable in...design project from concept through tapeout. Create and maintain chip design schedule and meet tight deadlines in accordance… more
    Northrop Grumman (11/02/24)
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  • RF/Analog Design/Mixed- Signal Engineering…

    Qualcomm (Boxborough, MA)
    …optimization, RFIC / Analog IC Design, PA architectures, RF Front-End Engineering, Signal Processing/Integration, RF microwave design, power amplifiers, WLAN / ... Amplifiers, Transmitter, Receiver, ACLR + Layout experience and chip tape-out + Programming Experience in Perl, MATLAB, Cadence,...signal IPs + Cadence Design Environment + Low power analog/digital design + Perl, Verilog, Shell, Python, Tcl,… more
    Qualcomm (08/20/24)
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  • Principal/Sr. Principal Analog Mixed Signal

    Northrop Grumman (Linthicum, MD)
    …(IC) Layout Engineers to join our team in the design and layout of custom, low- power , analog and mixed signal circuits. The ideal candidate will have experience ... (LVS, DRC), and parasitic extraction for a variety of analog/mixed signal circuits, Process Control Monitor (PCM) circuits, and physical measurement structures.… more
    Northrop Grumman (10/13/24)
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  • Analog Mixed Signal System Engineer

    Meta (Menlo Park, CA)
    …parallel link design, simulation, and validation (eg, Matlab, SPICE) Understanding of signal integrity and power integrity challenges in parallel interfaces 14. ... **Summary:** Meta is seeking an experienced Analog Mixed Signal System Engineer to join our Platform HW...Experience with chip - package -board co-design and co-validation for parallel links… more
    Meta (10/18/24)
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  • Analog / Mixed- Signal IC Design Engineer…

    Lightmatter (Mountain View, CA)
    Analog / Mixed- Signal IC Design Engineer Lightmatter builds chips that enable extreme-scale artificial intelligence computing clusters. If you're a collaborative ... and location. Responsibilities + Participate in the architecture development with our chip architects by leading feasibility studies + Collaborate with other design… more
    Lightmatter (08/16/24)
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  • Senior Packaging Technical Engineer…

    NVIDIA (CA)
    package design is preferred. + Good understanding of transmission line theory, power delivery and signal integrity is desired. + Strong programming and ... We are now looking for a Senior Packaging Technical Engineer. NVIDIA has continuously reinvented itself...you'll be doing: + Your responsibilities include defining the chip pad ring, substrate interconnect scheme, and lead the… more
    NVIDIA (11/02/24)
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  • Staff Power Integrity Engineer (Bay Area…

    Lightmatter (Boston, MA)
    …from concept to development. You will be part of the cross-functional systems and packaging team consisting of silicon, package and systems engineers and tasked ... with driving the package and system architecture definition from concept, through design...across digital, analog and photonics domains while meeting stringent signal and power integrity goals. Responsibilities +… more
    Lightmatter (10/04/24)
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  • Package Design Engineer

    Broadcom (San Jose, CA)
    …design responsibility for ASIC package designs, including aspects of signal integrity, power integrity, manufacturability, reliability, and thermal, in ... you apply.** **Job Description:** Broadcom is seeking an experienced package design engineer for complex flip- chip -BGA packages...package design, including high-speed SerDes . Knowledge of package -level signal integrity and power more
    Broadcom (11/01/24)
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  • Principal/Sr. Principal Engineer RF Microwave…

    Northrop Grumman (Baltimore, MD)
    …circuit board materials, design, fabrication, and assembly processes + Integrated Circuit packaging techniques including chip -and-wire, QFN, flip- chip + RF ... engineers with experience and interest in electronic assembly and packaging design. **What You'll get to Do:** + Designing,...lab equipment such as network analyzers, spectrum analyzers, signal generators, power meters, etc. + Antenna… more
    Northrop Grumman (09/07/24)
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  • Power Electronic Research Engineer - LV…

    Ford Motor Company (Dearborn, MI)
    …and high temperature circuit design, to integrate filtering solutions with power semiconductor packaging . + Understanding automotive applications and ... ** Power Electronic Research Engineer - LV circuit and...3+ years of Experience in architectural design of ASIC chip for traction inverter gate drive applications (coursework, internships,… more
    Ford Motor Company (09/05/24)
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  • Principal/Sr Principal Engineer RF Microwave…

    Northrop Grumman (Baltimore, MD)
    …Worst Case Circuit Analysis (WCCA) including logic compatibility, component derating, timing analysis, signal and power integrity analyses + Signal integrity ... circuit board materials, design, fabrication, and assembly processes + Integrated Circuit packaging techniques including chip -and-wire, QFN, flip- chip +… more
    Northrop Grumman (09/03/24)
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  • Senior Microelectronics Hardware Design Engineer

    Leidos (Arlington, VA)
    …modeling & simulation of key circuit parameters ( power , speed, timing, signal integrity, thermal, reliability, etc.) * Chip -Scale Design: digital, RF and/or ... mixed signal device packaging design/layout (2D-3D, chiplet/UCIe), substrate/interposer design... interconnect (chiplet, flipchip, wire/ribbon bonding), modeling & simulation ( power , speed, timing, signal integrity, thermal, structural,… more
    Leidos (10/31/24)
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  • Microelectronics ASIC Design Engineer

    Leidos (St. Petersburg, FL)
    …modeling & simulation of key circuit parameters ( power , speed, timing, signal integrity, thermal, reliability, etc.) + Chip -Scale Design: digital, RF and/or ... mixed signal device packaging design/layout (2D-3D, chiplet/UCIe), substrate/interposer design... interconnect (chiplet, flipchip, wire/ribbon bonding), modeling & simulation ( power , speed, timing, signal integrity, thermal, structural,… more
    Leidos (10/16/24)
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  • Principal Engineer - HBM SOC Physical Design - TPG

    Micron Technology, Inc. (Richardson, TX)
    …HBM technology pertains to stacking numbers of DRAM chips along with a logic chip within one package through an assembly technology called TSV (Through Silicon ... Via). This greatly increases the memory density in a package , while allowing very high-speed signal transmission. Furthermore, "high bandwidth"; is an… more
    Micron Technology, Inc. (10/24/24)
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  • Sr. SOC/ASIC Timing Signoff & Front-End…

    SpaceX (Irvine, CA)
    …physical implementation) + Analysis of clock domain crossing paths at block and full chip level + Work with mixed signal IP/PLL/SerDes/PHY teams to drive ... chip architecture, design verification, physical design, DFT, and power teams to achieve tapeout success on designs -...salary is just one part of your total rewards package at SpaceX. You may also be eligible for… more
    SpaceX (08/24/24)
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