- NY Creates (Albany, NY)
- …strategic partner development within the Albany Nanotech Complex. Own and drive NY Creates 3D and Heterogeneous Integration development in the Center for ... and commercialization. Job Description: Job Description for Manager of 3D /HI Integration JOB SUMMARY NY Creates is...for the Engineering and management of the NY Creates Heterogeneous and Packaging Integration group in support… more
- NY Creates (Albany, NY)
- …business development experience with Advanced Packaging semiconductor technology, including 3D and Heterogeneous Integration , and supply chain companies ... NY Creates: NY Creates serves as a bridge for advanced electronics, leads projects that advance R&D in emerging...2.5D or 3D SoC architectures, WLCSP, chiplet-based integration , heterogeneous integration , and/or Co-packaged… more
- NY CREATES (Albany, NY)
- …business development experience with Advanced Packaging semiconductor technology, including 3D and Heterogeneous Integration , and supply chain companies ... Direct experience with 2.5D or 3D SoC architectures, WLCSP, chiplet-based integration , heterogeneous integration , and/or Co-packaged optics. + Master's… more
- SpaceX (Bastrop, TX)
- …high-volume setting + Experience with advanced dicing for heterogeneous integration , such as chiplets or 3D stacking, or handling ultra-thin wafers + ... In true SpaceX fashion, Starlink is taking the next step in vertical integration by bringing integrated circuit packaging and assembly in-house for development and… more
- Global Foundries (Malta, NY)
- …Center (APPC) is at the forefront of enabling next-generation optical interconnects and heterogeneous integration (HI) for AI, HPC, and data center applications. ... deliver industry leading electro-optical transceiver s using GF 's Photonix platform and advanced packaging 2.5D and 3D co-packaged optics form fact ors meeting… more
- Global Foundries (Malta, NY)
- …Center (APPC) is at the forefront of enabling next-generation optical interconnects and heterogeneous integration (HI) for AI, HPC, and data center applications. ... + Expert in chip package interaction for 2D, 2.5D, 3D SiPh advanced packaging Preferred Qualifications: +...with failure analysis, design of experiments, & packaging process integration Expected Salary Range $166,300.00 - $291,200.00 The exact… more
- Texas A&M University System (College Station, TX)
- …tools. + Working knowledge of chemical mechanical polishing, flip-chip bonding, and 2.5D/ 3D heterogeneous integration . + Ability to operate independently ... lithography, photolithography, thin film deposition (electroplating, PVD, CVD, and ALD), 3D printing, wafer bonding, reactive ion etching (ICP-RIE and DRIE),… more
