- Micron Technology, Inc. (Boise, ID)
- …inspiring the world to learn, communicate and advance faster than ever. As an Advanced Packaging Senior Distinguished Member of Technical Staff in the Compute ... and Networking Business Unit (CNBU), you will lead Micron's Advanced Packaging strategy and drive innovation to ensure a leadership portfolio and best in class… more
- Micron Technology, Inc. (Folsom, CA)
- …team of domain experts across platforms, systems architecture, component design, and advanced packaging , you'll analyze platform architecture trade-offs in close ... + Collaborate with experts across SoC/memory design, memory systems architecture, and advanced packaging to explore tradeoffs and define architectures and… more
- Micron Technology, Inc. (Boise, ID)
- …yield, and reliability performance goals. + Support package architecture definition for advanced packaging projects as needed + Drive development of technical ... & Substrate group responsible for driving chip package interaction (CPI) packaging design rules and test vehicle strategies to support product development… more
- Micron Technology, Inc. (Folsom, CA)
- …expanding team of domain experts across platforms, systems architecture, component design, and advanced packaging , you will apply your deep knowledge of compute ... Micron Technology, Inc. has redefined innovation with the world's most advanced memory and semiconductor technologies. We're an international team of visionaries… more
Locations:
California,
Idaho