• Electronic Materials and Devices Research…

    Pennsylvania State University (University Park, PA)
    … and device fabrication + Knowledge of structural, chemical and electrical characterization + Excellent presentation, interpersonal, and communication skills ... defect structures and device fabrication. + Previous hands-on experience with electrical device/sensor characterization + Experience with all aspects of… more
    Pennsylvania State University (01/02/25)
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  • Microelectronics Test Engineer (Mid-Level…

    The Boeing Company (Tukwila, WA)
    …to SoCs to integrated chip sets, including bring up and debug, electrical testing, performance characterization , reliability stresses, radiation testing, and ... development + Test fixturing development + Hardware bring up and debug + Electrical testing and performance characterization + Test plan development and… more
    The Boeing Company (01/20/25)
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  • Principal Test Engineer - Kirtland, AFB

    BAE Systems (Albuquerque, NM)
    …characterizing radiation effects on FPAs for a variety of missions. As a test engineer , you will help plan and coordinate the labor, schedule, and hardware necessary ... PWB fabrication and assembly, and verifying the final assembly. + Review electrical interface requirements for upcoming test devices and design the PWBs (printed… more
    BAE Systems (01/18/25)
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  • Principal / Sr. Principal Test Systems…

    Northrop Grumman (Linthicum, MD)
    …Center (NGMC). Boasting state-of-the-art design capabilities, multiple processing nodes, electrical testing, environmental and QCI screening, and failure analysis, ... computing systems. MDA is seeking a **Principal/Sr. Principal Test Systems Engineer ** with demonstrated ability to lead development of new technologies to… more
    Northrop Grumman (01/15/25)
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  • Electronic-Photonic Process Design Kit (PDK)…

    MIT Lincoln Laboratory (Lexington, MA)
    …facilitate design, lithographic mask layout, material growth and characterization , fabrication (eg, silicon, compound-semiconductor, wafer bonding, flip-chip ... including lasers, waveguide photodetectors, optical modulators, and CMOS and cryogenic electronics with applications in quantum computing, atomic systems, advanced… more
    MIT Lincoln Laboratory (12/14/24)
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  • Integrated Circuit (IC) Layout and Mask Design…

    MIT Lincoln Laboratory (Lexington, MA)
    …facilitate design, lithographic mask layout, material growth and characterization , fabrication (eg, silicon, compound-semiconductor, wafer bonding, flip-chip ... including lasers, waveguide photodetectors, optical modulators, and CMOS and cryogenic electronics with applications in quantum computing, atomic systems, advanced… more
    MIT Lincoln Laboratory (12/11/24)
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