- Neotech (Chatsworth, CA)
- …assembly instructions, drawings and work instruction processes. + Written tests for ESD + Manual Die attach and Sub Attach requirements. + Use tools such as ... and surroundings. + Minimum 1 year working experience as a manual die attach /sub- attach operator in a microelectronic assembly factory. + Familiar with… more
- Micross Components (Apopka, FL)
- Summary: Perform duties to attach die to packages, set up and program wire bond machines, and wire bond die to packages according to build prints, complying ... Set oven at proper temperature for specjfic epoxy being used. Cure epoxy. + Attach die to package per build print. + Plasma clean parts. + Perform bond pull… more
- Mercury Systems (Phoenix, AZ)
- …equipment. In addition, you will set up and run Besi Datacon 2200 and Micron Die Attach machines, Topaz Chip Shooter, Asymtek epoxy dispense, EKRA and DEK ... electronic assembly operations on components or subassemblies * Technical Knowledge of Die attach , Wire bond, Epoxy Dispense, Flipchip, Wafer Die Eject, … more
- NY CREATES (Rochester, NY)
- …assembly equipment which may include photolithography, wafer bumping, singulation, pick & place, die attach , wire bond, flip chip, underfill and solder reflow ... + Diagnose failures using various characterization, test and analytical instruments including die shear, wire-pull, X-ray and CSAM. + Work inside the clean room… more
- Teledyne (Mountain View, CA)
- …+ Assists in new product development with emphasis in auto wire-bonding and auto die attach . + Lead the transfer of processes, process improvements, and products ... or related filed. + Preferred background in electronics assembly (wire bonding, die /component attach ) and processes. + Preferred knowledge and experience with… more
- Mercury Systems (Fremont, CA)
- …documentation necessary to track the traveler and the assembler's performance. Job Responsibility: * Die attach and Wire bonding Die level components from ... gold wire and 2-3 gold mil ribbon bonds * Experience with Substrate and Die attach with Silver Epoxy * Experience performing detailed work under a microscope *… more
- Teledyne (Hawthorne, CA)
- …+ May perform a wide variety of other assembly operations such as touch-up, hand solder, die attach , substrate attach and clip attach as assigned once ... variety of other related equipment, including high-powered microscopes, Dage wire pull and die shear equipment with speed and accuracy + Operate cleaning and bake… more
- Micron Technology, Inc. (Boise, ID)
- …Extensive knowledge and familiarity with substrate design and substrate manufacturing process, die attach materials (DAF) and Molding compounds + Representation ... + Work well in advance on upcoming fab nodes on new die designs to assure that die can be packaged as required in roadmaps, highlight risks with mitigation… more
- Teledyne (Mountain View, CA)
- …source control drawings. + Demonstrate expertise in electronic component finishes, including die attach , wire bonding, solderability, tin whisker mitigation, and ... compliance. + Utilize knowledge of alternate sources for bare die and obsolete components. + Apply expertise in packaged...obsolete components. + Apply expertise in packaged and bare die components such as RF MMICs, PIN diodes, discrete,… more
- Micross Components (Apopka, FL)
- …Knowledge of Mil-STD-883 / Mil-STD-750 in test methods with related equipment (wire bond, die attach , & furnace) a plus. + Knowledge or experience with Automatic ... assembly equipment for Wire bond, Die attach a plus + Knowledge in semiconductor manufacturing a plus. + Self-motivated with the ability to align priorities in… more
- Skyworks (San Jose, CA)
- …and establish baselines for assembly and packaging including: + SMT + Flip chip + Die attach , molding, underfill, dispense, EMI shielding, lid, and solder ball ... attach + 3D stack die technology + Heterogeneous integration + Collaborate, contribute to and drive implementation of advanced packaging and assembly technologies… more
- Teledyne (Mountain View, CA)
- …specifications. + Perform die shear per MIL-STD-883 specifications. + Perform die attach using epoxy, gold-tin, gold germanium, and gold-silicon performs. + ... Perform substrate attach to carriers using epoxy, gold-tin, gold-germanium, and gold silicone performs. + Perform 100% in-process inspection at each assigned process… more
- Micross Components (Shirley, MA)
- …preferred. + Microelectronic manufacturing environment experience required + Epoxy, hot gas die attach , experience required + Wire bonding (manual and ... for high reliability and state-of-the-art electronics, Micross' solutions range from bare die and wafer processing to advanced and custom packaging to component… more
- SpaceX (Bastrop, TX)
- …functional testing of electronic materials such as thermal interface materials, underfill, die attach adhesives, wafer bonding, molding compounds, PCB prepregs, ... equipment, including but not limited to: mechanical testing (ie, wire bond, die shear and peel testing), electrical testing (ie, permittivity measurements), and… more
- Renesas (Palm Bay, FL)
- …devices. Operates various equipment in performing functions such as wafer scribe and break, die sort, die attach , lead bonding and seal, test, or ... mark and pack. Reads, collects and records data. Qualifications Candidate will be required to work in a clean room environment, including wearing clean room garments. Candidates with previous manufacturing experience that required multi-tasking and microscope… more
- Renesas (Palm Bay, FL)
- …devices. Operates various equipment in performing functions such as wafer scribe and break, die sort, die attach , lead bonding and seal, test, or ... mark and pack. Reads, collects and records data. Using a high power and/or low power microscope will be required for all operations. Candidate will be required to work in a clean room environment, including wearing clean room garments. Candidates with previous… more
- BAE Systems (Nashua, NH)
- … (duroid/ceramic), MMICs, IC's, caps, diodes and resistors, soldering skills and eutectic die attach . + Must be familiar with lamination presses, bladder bag ... ovens and sheet epoxies (mainly with the focus of attaching substrates to modules/housings). + Must be familiar with working with a wide variety of adhesives and epoxy's. + Must be familiar with operating an MRSI 705 and 175. + Must be able to work with a… more
- BAE Systems (Nashua, NH)
- … (duroid/ceramic), MMICs, IC's, caps, diodes and resistors, soldering skills and eutectic die attach . Must be familiar with lamination presses, bladder bag ovens ... and sheet epoxies (mainly with the focus of attaching substrates to modules/housings). Must be familiar with working with a wide variety of adhesives and epoxies. Must be able to work with a microscope for an entire shift. Can fabricate and/or modify complex… more
- Honeywell (Plymouth, MN)
- …and equipment (including RIE, PVD, PECVD, LPCVD, wet etching, CMP, lithography, plating, die attach , flip chip assembly, column attach and mechanical ... interactions) * Strong problem-solving and analytical skills * USG Secret security clearance in good standing, or US Citizenship and no known barriers to achieve a USG Secret security clearance [non-citizens are ineligible for clearance] WE VALUE * Master's or… more
- BAE Systems (Nashua, NH)
- …with substrate attach (duroid/ceramic), MMICs, IC's, caps, diodes and resistors and eutectic die attach . Must be familiar with working with a wide variety of ... adhesives and epoxies. Must be able to work with a microscope for an entire shift. Can fabricate and/or modify complex microwave/RF integrated circuit modules and sub-assemblies. Must be familiar with MIL-STD-883 and working with bonding complex microwave… more
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