- Micron Technology, Inc. (Boise, ID)
- …(TFTs), among others. + Engage with numerous cross-functional teams including process development, product engineering, design, yield improvement, advanced mask ... an individual with a proven track-record of innovation and advanced -node development to serve as a member of our...will include integration and circuit issues specific to 3D DRAM technology. In addition to a broad basis of… more
- Micron Technology, Inc. (Boise, ID)
- …degree in Electrical Engineering or equivalent with at least 10 years of advanced CMOS experience, additional experience with DRAM a plus + Semiconductor ... Responsible for developing novel CMOS solutions for the future generations of DRAM and emerging memories necessary to meet the required array efficiency and… more
- Micron Technology, Inc. (Boise, ID)
- …needed for Logic, DRAM , and GDDR flip chip memory products on advanced fab process nodes. + Partner with package/Si design, product architecture, CPI ... development and NPI needs for flip chip products on advanced process nodes. This role offers an...will include, but are not limited to: + Logic, DRAM , and Graphic flip chip package interaction (CPI) design… more
- Micron Technology, Inc. (Boise, ID)
- …Level Packaging Technologies Team in Boise, Idaho. **OUR OPPORTUNITY SUMMARY** As an Advanced Package TD Process Integration Engineer at Micron, you will define ... requirements, build program plans, and secure resources to drive process technology development programs. More specifically, you will develop... Advanced Packaging Industry + Deep knowledge of Advanced Package Integration and DRAM or other… more
Locations:
Idaho