- Micron Technology, Inc. (Boise, ID)
- …level bonding, or MS degree + 1-2(+) years of industry experience specific to Advanced Packaging and wafer-to-wafer bonding As a world leader in the ... to learn, communicate and advance faster than ever. As a Process Integration Engineer you will be primarily responsible for starting up, developing and optimizing… more
- Micron Technology, Inc. (Boise, ID)
- …to join our Wafer Level Packaging Technologies Team in Boise, Idaho. As an Advanced Package TD Process Integration Engineer at Micron, you will define ... **Qualifications and Skills** + At least 5 years experience in advanced packaging industry + Degree/Major: MS or Ph.D. in Electrical, Computer Engineering,… more
- Micron Technology, Inc. (Boise, ID)
- …faster than ever. We are seeking a highly skilled and experienced Electroplating Engineer to join our team! The ideal candidate will have extensive experience with ... processes, specifically copper pillars, binary and ternary metallurgies. + ** Technical Skills:** Proficient in plating techniques, process optimization, and quality… more
- Micron Technology, Inc. (Boise, ID)
- **Our vision is to transform how the world uses information to enrich life for** **_all_** **.** Micron Technology is a world leader in innovating memory and storage ... solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. * Identify, diagnose and resolve assembly process related problems * Coordinate and execute process,… more
- Micron Technology, Inc. (Boise, ID)
- …Level Packaging Technologies Team in Boise, Idaho. **OUR OPPORTUNITY SUMMARY** As an Advanced Package TD Process Integration Engineer at Micron, you will ... Materials, or a related field + At least 8 years' experience in Advanced Packaging Industry + Deep knowledge of Advanced Package Integration and DRAM… more
- Micron Technology, Inc. (Boise, ID)
- …to join our Wafer Level Packaging Technologies Team in Boise, Idaho. As an Advanced Package TD Process Integration Engineer at Micron, you will define ... domains **Qualifications and Skills:** + At least 5 years experience in advanced packaging industry + Deep knowledge advanced package integration and DRAM… more
Locations:
Idaho