• Interposer Physical Design

    Google (Sunnyvale, CA)
    …field, or equivalent practical experience. + 10 years of experience in ASIC physical design flows and methodologies in advanced process nodes. + Experience ... routing or PnR tool routing. + Experience with layout, physical verification, Design for Manufacturability (DFM), power...+ Experience with leading one or more aspects of interposer or package design . + Experience in… more
    Google (11/29/24)
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  • ASIC Packaging Engineer

    Meta (Sunnyvale, CA)
    …with existing empirical data 13. Hands of mechanical modeling stress analysis experience for interposer or fanout package design for both organic and inorganic ... **Summary:** Meta is looking for an experienced ASIC Packaging Engineer , Mechanical/Thermal modeling focus for its ASIC packaging team to support the development of… more
    Meta (11/14/24)
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  • ASIC Lead Engineer , Project Taara (Fixed…

    Google (Mountain View, CA)
    …techniques on system performance and cost. + Experience with flip-chip packaging, interposer design , and vendor engagements for prototyping. + Proficiency with ... ASIC Lead Engineer , Project Taara (Fixed Term) Hardware Engineering Mountain...input from various teams, contribute to the detailed circuit design , own the foundry submission process, oversee physical more
    Google (10/18/24)
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  • Chip Package Signal and Power Integrity…

    Google (Sunnyvale, CA)
    …, silicon bridge, 3D die stacking. + Experience in cross-functional collaboration with chip top design , physical design , STA, package, system design , and ... integration. As a Chip Package Signal and Power Integrity Engineer you will be responsible for the chip package...of a larger team with Chip Architects, ASIC Engineers, Physical Design and other SI/PI Engineers. You… more
    Google (11/12/24)
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  • 3D Heterogenous Integration Engineer (2025…

    Global Foundries (Malta, NY)
    …is a leading full-service semiconductor foundry providing a unique combination of design , development, and fabrication services to some of the world's most inspired ... connections and skills.​ Summary of Role: 3D Advanced Heterogeneous Integration Development Engineer which includes wafer to wafer hybrid bonding, die to wafer… more
    Global Foundries (11/05/24)
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