• Lead , Microelectronics

    L3Harris (Palm Bay, FL)
    Job Title: Lead , Microelectronics Packaging Design Engineer Job Code: 16841 Job Location: Palm Bay, FL Job Schedule: 9/80 (Every other Friday off!) ... and layout multilayer structures, lead team to create all necessary design files and documentation for advanced packaging designs. + Perform finite element… more
    L3Harris (10/14/24)
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  • Senior Microelectronics Hardware…

    Leidos (Arlington, VA)
    **Description** The EW Division of Leidos is looking for a Senior Microelectronics Design Engineer to work with a multi-disciplined design team (electrical ... etc.) * Chip-Scale Design : digital, RF and/or mixed signal device packaging design /layout (2D-3D, chiplet/UCIe), substrate/interposer design (HDI, HDBU,… more
    Leidos (08/01/24)
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  • Associate Director - Program Manager (Value Stream…

    RTX Corporation (Cedar Rapids, IA)
    …and lead the business strategy and vision for the Microelectronics Critical Technology Area (CTA), coordinating technical efforts across several other Level ... in our growing portfolio. This Value Stream Leader will lead and have profit and loss responsibility for Research...of products and systems in the following areas: secure design , assembly, advanced packaging , and test capabilities;… more
    RTX Corporation (10/12/24)
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  • Sr. Semiconductor Advanced Packaging

    L3Harris (Palm Bay, FL)
    …to internal and external customers + Experience in advanced microelectronics packaging including through silicon vias, redistribution layers ... Job Title: Sr. Semiconductor Advanced Packaging Designer (Cadence Allegro) Job Code: 16822 Job...RCCAs, and leads a team of designers. + Create design process control documentation and mentor/ lead other… more
    L3Harris (10/14/24)
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  • Analog Mixed Signal Integrated Circuit…

    The Boeing Company (Tukwila, WA)
    …definition, circuit design , RTL, synthesis, physical layout, verification, packaging and testing). SSED owns numerous microelectronics projects, funded ... Currently SSED is actively hiring an **Analog Mixed Signal Integrated Circuit (IC) Design Engineer (Mid-Level or Lead ),** who has expertise Analog Mixed Signal… more
    The Boeing Company (10/17/24)
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  • Digital Integrated Circuit Design Engineer…

    The Boeing Company (Huntington Beach, CA)
    …Within BR&T, Boeing's Solid State Electronics Development organization (SSED) performs microelectronics technology development and design for aerospace systems. ... wafer fabrication but performs design (architecture, RTL, synthesis, circuits, physical design , verification, packaging and test) in house. SSED has numerous… more
    The Boeing Company (10/04/24)
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  • Lead Analog Mixed Signal Design

    The Boeing Company (Tukwila, WA)
    …definition, circuit design , RTL, synthesis, physical layout, verification, packaging and testing). SSED owns numerous microelectronics projects, funded ... hardware in support of these projects. We are actively looking to fill a ** Lead Analog Mixed Signal Design Engineer** role in SSED. Ideal candidate would be… more
    The Boeing Company (10/17/24)
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  • Principal/Sr. Principal Design Systems…

    Northrop Grumman (Linthicum, MD)
    …"More than Moore" solutions. One of our most challenging new fields is Microelectronics Design and Applications (MDA), which combines the unique properties of ... big and small - solutions living within the Northrop Grumman Microelectronics Center (NGMC). Boasting state-of-the-art design capabilities, multiple processing… more
    Northrop Grumman (10/24/24)
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  • Sr. Staff Design Systems Engineer (Fa878)

    Northrop Grumman (Linthicum, MD)
    …"More than Moore" solutions. One of our most challenging new fields is Microelectronics Design and Applications (MDA), which combines the unique properties of ... big and small - solutions living within the Northrop Grumman Microelectronics Center (NGMC). Boasting state-of-the-art design capabilities, multiple processing… more
    Northrop Grumman (10/16/24)
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  • Digital Integrated Circuit Physical Design

    The Boeing Company (Huntington Beach, CA)
    …Within BR&T, Boeing's Solid State Electronics Development organization (SSED) performs microelectronics technology development and design for aerospace systems. ... wafer fabrication but performs design (architecture, RTL, synthesis, circuits, physical design , verification, packaging and test) in house. SSED has numerous… more
    The Boeing Company (10/17/24)
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  • Sr. Principal System Architect PCM Team…

    Northrop Grumman (Linthicum, MD)
    …big and small - solutions living within the Northrop Grumman Microelectronics Center (NGMC). Boasting state-of-the-art design capabilities, multiple processing ... analysis, the NGMC is a leader in designing, fabricating, packaging and delivering discriminating microelectronics to the...is seeking a **Sr. Principal System Architect PCM Team Lead ** to join our team and develop these technologies… more
    Northrop Grumman (10/28/24)
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  • FAST Labs - Program Engineering Manager II…

    BAE Systems (Merrimack, NH)
    …and/or production programs. The successful applicant will bring a strong microelectronics design , production, and test background. **Responsibilities Include:** ... & SoC development leading engineering disciplines through chip concept, requirements, design , packaging , functional test, production test, and qualification +… more
    BAE Systems (10/12/24)
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  • Senior Staff Systems Engineering Integration…

    Northrop Grumman (Annapolis Junction, MD)
    …"More than Moore" solutions. One of our most challenging new fields is Microelectronics Design and Applications (MDA), which combines the unique properties of ... big and small - solutions living within the Northrop Grumman Microelectronics Center (NGMC). Boasting state-of-the-art design capabilities, multiple processing… more
    Northrop Grumman (10/28/24)
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  • Sr. Staff Systems Engineering Integration and Test…

    Northrop Grumman (Linthicum, MD)
    …"More than Moore" solutions. One of our most challenging new fields is Microelectronics Design and Applications (MDA), which combines the unique properties of ... big and small - solutions living within the Northrop Grumman Microelectronics Center (NGMC). Boasting state-of-the-art design capabilities, multiple processing… more
    Northrop Grumman (10/27/24)
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  • Staff Engineer DevOps (DevOps Team Lead )

    Northrop Grumman (Linthicum, MD)
    …"More than Moore" solutions. One of our most challenging new fields is Microelectronics Design and Applications (MDA), which combines the unique properties of ... big and small - solutions living within the Northrop Grumman Microelectronics Center (NGMC). Boasting state-of-the-art design capabilities, multiple processing… more
    Northrop Grumman (10/24/24)
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  • Principal/ Sr. Principal Tableau Data Engineer…

    Northrop Grumman (Linthicum, MD)
    …"More than Moore" solutions. One of our most challenging new fields is Microelectronics Design and Applications (MDA), which combines the unique properties of ... big and small - solutions living within the Northrop Grumman Microelectronics Center (NGMC). Boasting state-of-the-art design capabilities, multiple processing… more
    Northrop Grumman (10/07/24)
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  • Senior Product Development Manager

    Mercury Systems (Phoenix, AZ)
    …strategic partnerships to access the latest in commercial technologies to design , manufacture, test, and deliver ruggedized microelectronics . Our products ... Technologies business unit (BU) seeks a Senior Product Development Manager to lead the Data Management and Microelectronics (DM&M) product development process… more
    Mercury Systems (10/02/24)
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  • Electronics Design Engineer - Avionics…

    Amentum (Houston, TX)
    …across the United States. We have an exciting opportunity for an Electronics Design Engineer - Avionics Radiation Hardness Assurance Engineer to join the team. The ... Electronics Design Engineer - Avionics Radiation Hardness Assurance Engineer will:...(SME) and/or specialty engineering field in radiation effects in microelectronics for NASA spaceflight (or similar complexity): + Work… more
    Amentum (09/30/24)
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  • Principal/Sr Principal Manufacturing…

    Northrop Grumman (Linthicum, MD)
    …"More than Moore" solutions. One of our most challenging new fields is Microelectronics Design and Applications (MDA), which combines the unique properties of ... big and small - solutions living within the Northrop Grumman Microelectronics Center (NGMC). Boasting state-of-the-art design capabilities, multiple processing… more
    Northrop Grumman (10/22/24)
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  • Principal/Sr. Principal Manufacturing Data…

    Northrop Grumman (Linthicum, MD)
    …"More than Moore" solutions. One of our most challenging new fields is Microelectronics Design and Applications (MDA), which combines the unique properties of ... big and small - solutions living within the Northrop Grumman Microelectronics Center (NGMC). Boasting state-of-the-art design capabilities, multiple processing… more
    Northrop Grumman (10/26/24)
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