- Micron Technology, Inc. (Boise, ID)
- …technology nodes, maintaining Micron's leadership in the industry. **Position Overview:** As a Principal Process Engineer in Advanced Packaging, you will be ... faster than ever. **Department Intro:** The Advanced Packaging Technology Development ( APTD ) department at Micron Technology is at the forefront of innovation,… more
- Micron Technology, Inc. (Boise, ID)
- …Micron's leadership in the industry. As a Principal RDA and Metrology Engineer in APTD , you will be primarily responsible for creating, developing, and ... communicate and advance faster than ever. The Advanced Packaging Technology Development ( APTD ) department at Micron Technology is at the forefront of innovation,… more
- Micron Technology, Inc. (Boise, ID)
- …faster than ever. **Department Intro:** The Advanced Packaging Technology Development ( APTD ) department at Micron Technology is at the forefront of innovation, ... Micron's leadership in the industry. **Position Overview:** The Thermal Simulation Engineer will be directly involved in developing new and derivative advanced… more
- Micron Technology, Inc. (Boise, ID)
- …faster than ever. **Department Intro:** The Advanced Packaging Technology Development ( APTD ) department at Micron Technology is at the forefront of innovation, ... in the industry. **Position Overview:** We are seeking an experienced Design Engineer to join our TSV Packaging team. High-performance memory devices like HBM,… more
Locations:
Idaho