• Principal Engineer - HBM SOC Design…

    Micron Technology, Inc. (Richardson, TX)
    …and high-quality RTL development with the ability to write and test code in System Verilog. + Experience with automating IP integration using standards such as ... to enrich life. As an HBM SOC Design and Integration Engineer, you will be responsible for the design...stacking numbers of DRAM chips along with a logic chip within one package through an assembly technology called… more
    Micron Technology, Inc. (10/24/24)
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  • Systems Engineer Lead - Demo System

    The Boeing Company (El Segundo, CA)
    …technologies. This team is looking for a ** Systems Engineer Lead - Demo System (Senior or Principal )** to be based out of **El Segundo, California.** **Job ... system physical design. + Oversee development of Systems Electronics/Device Modeling and integration with larger...through-hole and intra-layer dielectric technologies, as well as 3D chip technologies. + Experience in working in an agile… more
    The Boeing Company (10/17/24)
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  • Senior Principal Design Engineer…

    Cadence Design Systems, Inc. (San Jose, CA)
    …and innovators who want to make an impact on the world of technology. Senior Principal Design Engineer - Systems and Interfaces San Jose Job Description: The ... engineer to integrate and support Cadence IP products in system reference designs. This Systems CAE will...experience with high-speed I/O interfaces. + Experience in IP integration , SoC system architecture, interfaces, and interconnects.… more
    Cadence Design Systems, Inc. (10/08/24)
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  • Principal Systems Engineer - Power…

    Microsoft Corporation (Phoenix, AZ)
    …applications. + Fundamental understanding of chip design, including Vary Large System Integration (VLSI), packaging, and yield. + Familiar with developing ... world's workloads across the cloud. We are seeking a principal Systems Engineer to join the CO+I...center different liquid cooling technologies. + Knowledge of server system architecture with hands-on experience in the integration more
    Microsoft Corporation (10/23/24)
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  • Principal IC Packaging Engineer, Silicon…

    SpaceX (Bastrop, TX)
    …assembly processes including material characterization and down-selection for wafer-level and chip -level systems + Develop new technologies and establish ... development + Familiarity with 2D, 2.5D, and/or 3D packaging integration + Packaging familiarity with flip- chip , BGA,...chip , BGA, fcCSP, WLCSP, fan out FO processes, system -in-package SiP, multi- chip modules MCM, wirebond, panel… more
    SpaceX (10/27/24)
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  • Principal Failure Analysis Engineer,…

    SpaceX (Bastrop, TX)
    …with flip- chip , BGA, fcCSP, WLCSP, fan out FO processes, system -in-package SiP, multi- chip modules MCM, wirebond, panel level packaging, heterogenous ... Principal Failure Analysis Engineer, Silicon Technology (Starlink) at...to deploy Starlink, the world's most advanced broadband internet system . Starlink is the world's largest satellite constellation and… more
    SpaceX (10/01/24)
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  • Senior Principal RF Engineer

    BAE Systems (Totowa, NJ)
    **Job Description** BAE Systems is hiring for a Senior Principal RF Engineer. At BAE Systems , we deliver a full range of products and services for air, land ... from you! This role will be supporting multiple engineering development, integration , test and transition to production efforts on complex electronic modules.… more
    BAE Systems (09/27/24)
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  • Principal RF Wireless Engineer

    Renesas (San Diego, CA)
    …Lead the overall chip development activities by taking responsibility for chip -level integration and optimization. Qualifications 15+ years of experience in ... Principal RF Wireless Engineer Job Description Principal...innovative circuits for Satcom and 5G networks and radar systems , mainly focusing on high performance circuits in silicon… more
    Renesas (10/22/24)
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  • Principal Electrical Engineer

    Mercury Systems (Phoenix, AZ)
    …with a strategic focus on skills needed across Microelectronics, including Multi Chip Modules, Radiation Tolerant Space, and System -in-Package (SiP). This ... Mercury's Microsystems business is seeking an experienced Principal Electrical Engineer to join our growing, engaging, and collaborative team. As a valued team… more
    Mercury Systems (11/04/24)
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  • Principal FPGA Design Engineer - $10K Sign…

    BAE Systems (Westminster, CO)
    …of concept, and production programs. + FPGA development and digital IP integration for tactical RF, high reliability electronic systems . Assignments include ... advanced function implementation in FPGAs. + Solid electronic circuit design and electronic systems background. + Expertise in VHDL/Verilog and System Verilog. +… more
    BAE Systems (10/23/24)
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  • Principal /Sr. Principal RF MMIC…

    Northrop Grumman (Linthicum, MD)
    …development of computer architectures, processing/memory subsystems, and large-scale high-performance computing systems . MDA is seeking a ** Principal / Senior ... a proven record of successful tape-outs; ability to design sub-blocks and perform chip -level integration . + Proficiency with Cadence Virtuoso or similar IC… more
    Northrop Grumman (11/05/24)
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  • Principal /Sr. Principal Analog…

    Northrop Grumman (Linthicum, MD)
    … IC Layout Engineer: + Experience with hierarchical design, top-level floor-planning, and chip -level integration . + Understanding of the Process Design Kit (PDK) ... our employees have incredible opportunities to work on revolutionary systems that impact people's lives around the world today,...are required. **This position can be filled at the Principal IC Layout Engineer OR the Sr. Principal more
    Northrop Grumman (10/13/24)
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  • Principal /Sr. Principal Engineer RF…

    Northrop Grumman (Baltimore, MD)
    …Northrop Grumman, our employees have incredible opportunities to work on revolutionary systems that impact people's lives around the world today, and for generations ... printed circuit board fabrication and assembly to subsystem level integration and test + Working directly with a wide...receiver/exciter subsystems This requisition may be filled as a Principal Engineer or a Sr. Principal Engineer.… more
    Northrop Grumman (09/07/24)
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  • Principal Digital Engineer/Senior…

    Northrop Grumman (Linthicum, MD)
    …Board Computers, Multi- chip Modules, SiPs, SoCs, ASICs, and FPGAs. Perform integration and test for subsystems and modules. + Design and model specific aspects ... EO/IR Sensors, Sonar and Acoustic Sensors, AI & ML, Multi- chip Modules, System in a Package, Hardware...process, CI/CD design flow. + Experience with board or system level integration , test and debug using… more
    Northrop Grumman (10/15/24)
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  • Principal Software Engineering Lead

    Microsoft Corporation (Redmond, WA)
    Microsoft **Windows Silicon & System Integration ** team ( **WSSI** ) is on a journey to deliver iconic end-to-end products across hardware, software, and ... strong development background in firmware and drivers on x86/ARM system on chip (SOCs) for windows platform....establish engineering requirements and deliverables, and oversee the complete integration of systems and software. They will… more
    Microsoft Corporation (10/29/24)
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  • Sr./ Principal Analog Architect

    Lightmatter (Mountain View, CA)
    …analyze solutions. This role requires a deep understanding of high-frequency systems -on- chip (SoCs), high-speed (40+ GHz) electro-optic interfaces, silicon ... ​​Sr./ Principal Analog Architect Lightmatter builds chips that enable...photonics, and 3D integration . The role also requires creativity, analytical skills, and… more
    Lightmatter (08/17/24)
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  • Principal /Sr. Principal IC Design…

    Northrop Grumman (Linthicum, MD)
    …advanced CMOS nodes. + Experience with hierarchical design, top-level floor-planning, and chip -level integration . + Experience in low power analog and mixed ... our employees have incredible opportunities to work on revolutionary systems that impact people's lives around the world today,...circuit requirements. **This position can be filled at the Principal IC Design Engineer OR the Sr. Principal more
    Northrop Grumman (10/27/24)
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  • Principal Analog IC Design Engineer

    Skyworks (Irvine, CA)
    Principal Analog IC Design Engineer Apply now " Date:Oct 29, 2024 Location: Irvine, CA, US Company: Skyworks If you are looking for a challenging and exciting career ... as guiding and helping the design community in their integration and performance verification via simulation. In this role...requirements from various design teams and work with our systems team to define the specifications for Skyworks' IP… more
    Skyworks (10/01/24)
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  • SMTS Analog IC Principal Design Engineer

    Skyworks (Irvine, CA)
    SMTS Analog IC Principal Design Engineer Apply now " Date:Oct 26, 2024 Location: Irvine, CA, US Company: Skyworks If you are looking for a challenging and exciting ... as guiding and helping our design community in their integration and performance verification. In this role, you will...requirements from various design teams and work with our systems team to define specifications for the overall business… more
    Skyworks (09/28/24)
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  • Sr. Principal RF SOI IC Design Engineer

    Skyworks (Irvine, CA)
    …in developing RF/Microwave RF SOI IC design in the concept, design, integration , and delivery of complex multi- chip , multi-technology RFIC-based wireless module ... Sr. Principal RF SOI IC Design Engineer Apply now...analog/digital,& RF semiconductors, Acoustic Filters and integrating ultra dense System -in-Package (SiP) solutions that will be powering the next… more
    Skyworks (09/18/24)
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