• Principal Silicon Circuits…

    NVIDIA (Santa Clara, CA)
    …collection, test case execution, and results analysis. + Find creative solutions to complex silicon and system -level problems and be on the frontline to lead ... more
    NVIDIA (03/06/25)
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  • Principal IC Packaging Engineer,…

    SpaceX (Bastrop, TX)
    Principal IC Packaging Engineer, Silicon Technology (Starlink) at SpaceX Bastrop, TX SpaceX was founded under the belief that a future where humanity is out ... more
    SpaceX (01/26/25)
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  • Principal /MTS SOC Pre- Silicon

    Micron Technology, Inc. (Richardson, TX)
    …transforming how the world uses information to enrich life. As an HBM SOC Pre- Silicon Verification Engineer, you will be responsible for the design & development of ... more
    Micron Technology, Inc. (03/20/25)
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  • Principal IC Packaging Test Engineer,…

    SpaceX (Bastrop, TX)
    Principal IC Packaging Test Engineer, Silicon ...will work closely with test equipment manufacturers and in-house chip & system designers to develop and ... more
    SpaceX (01/26/25)
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  • Principal Architect - Novel Advanced…

    HP Inc. (Corvallis, OR)
    …focus on advanced techniques such as 2.5D/3D integration, fan-out packaging, or system -on- chip (SoC) solutions. **Technical Expertise:** + Deep knowledge of ... more
    HP Inc. (02/05/25)
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  • Principal Thermal Mechanical Photonic…

    NVIDIA (Santa Clara, CA)
    …products. Teams are dedicated to the architecture and design of CMOS and Silicon -Photonics high-speed chip interfaces (NVLink, IEEE, PCIE, USB, OIF) and other ... more
    NVIDIA (01/13/25)
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  • Senior Principal Product Manager

    Mercury Systems (Peachtree Corners, GA)
    Job Summary: This is an exciting role as a Senior Principal Product Manager with Mercury Systems charting the future of mission-critical high-performance ... more
    Mercury Systems (03/12/25)
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  • Principal Engineer - HBM SOC Design…

    Micron Technology, Inc. (Richardson, TX)
    …HBM technology pertains to stacking numbers of DRAM chips along with a logic chip within one package through an assembly technology called TSV (Through Silicon ... more
    Micron Technology, Inc. (03/07/25)
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  • Sr. Principal Design verification engineer

    Cadence Design Systems, Inc. (Austin, TX)
    …Skills required > Minimum 10 years of experience in Processor based full chip verification / IP Verification Knowledge of Verilog/ System Verilog, digital ... more
    Cadence Design Systems, Inc. (02/04/25)
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  • Sr. Principal Analog Mixed Signal Design…

    Skyworks (Nashua, NH)
    Sr. Principal Analog Mixed Signal Design Engineer Apply now " Date:Mar 23, 2025 Location: Nashua, NH, US Company: Skyworks If you are looking for a challenging and ... more
    Skyworks (01/28/25)
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  • Principal Software Engineer - RDMA

    Microsoft Corporation (Santa Clara, CA)
    Microsoft Silicon , Cloud Hardware, and Infrastructure Engineering (SCHIE) is the team behind Microsoft's expanding Cloud Infrastructure and responsible for powering ... more
    Microsoft Corporation (02/08/25)
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  • Sr. Staff Design Engineer (Low Power)

    Qualcomm (Santa Clara, CA)
    …will be responsible to develop technical specifications from Architectural and systems requirements and deliver detailed low power micro-architecture and design. ... more
    Qualcomm (01/09/25)
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  • Thermal/Limits Systems Software Engineer

    Qualcomm (San Diego, CA)
    …Python + Strong familiarity with ARM architecture + Good understanding of System On Chip architectural concepts. + Experience in Power/Thermal/Performance ... more
    Qualcomm (03/20/25)
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