- Henkel (Irvine, CA)
- …product lines and/or product classes by novel approaches to application process development , troubleshooting, and material characterization. **What makes you ... packaging environment. + Good understanding for the latest Semiconductor Packaging trend. Especially 2.5D and 3D...package + Expertise in wafer level encapsulation and molding process in semiconductor package + Have strong… more
- Micron Technology, Inc. (Boise, ID)
- …Physics, or other related field + 0-6 years of direct experience working as a process development engineer in an R&D environment + Knowledge of Advanced Package ... the world to learn, communicate and advance faster than ever. The Advanced Packaging Technology Development (APTD) department at Micron Technology is at the… more
- Micron Technology, Inc. (Boise, ID)
- …and statistical analysis tools + Interest in advanced packaging and interconnect development As a world leader in the semiconductor industry, Micron is ... such as KT (Kepner-Tregoe) + Define and implement Design of Experiments (DoE) for process development + Present findings and collaborate across sites and teams +… more
- SanDisk (Milpitas, CA)
- …within a technical organization. + Deep understanding of semiconductor packaging processes, supply chain dynamics, and product development lifecycles. ... of Staff to the Vice President of Package Technology Development and Integration is a strategic and operational leader...Engineering organization. This role requires a strong background in semiconductor packaging technologies, as well as the… more
- NY CREATES (Albany, NY)
- …development , device integration, process development , and device/ process characterization for advanced CMOS or related semiconductor technologies. ... NY Creates state-of-the-art 300 mm fab, focusing on technology development , device integration, process development ,...Solid understanding of device physics, semiconductor process integration, and material systems relevant to FEOL and… more
- Micron Technology, Inc. (Boise, ID)
- …5+ years of experience in Advanced Packaging Technology metrology or RDA development for semiconductor products + Strong knowledge of RDA tooling capability, ... out sensitivity and gauge evaluation/optimization to implement changes at process step + Lead and participate in yield improvement...directly with Advanced Packaging metrology or RDA development in the semiconductor industry + Data… more
- Micron Technology, Inc. (Boise, ID)
- …Virtual Metrology, AI, process control, yield improvement, quality control, semiconductor process engineering, image analytics, or related semiconductor ... analyzing and extracting valuable insights from large datasets related to semiconductor manufacturing, process optimization, and quality control. You'll… more
- Micron Technology, Inc. (Boise, ID)
- …your work will be to address all Thermal aspects of 2.5D and 3D advanced packaging development that are related to design, material and process interactions. ... learn, communicate and advance faster than ever. **Department Intro:** The Advanced Packaging Technology Development (APTD) department at Micron Technology is at… more
- Micron Technology, Inc. (Boise, ID)
- …Process Control (SPC), Defect analysis and data analysis + Experience in semiconductor process engineering and packaging with fundamental understanding of ... and advance faster than ever. **Department Intro:** The Advanced Packaging Technology Development (APTD) department at Micron... process capability + Collaborating with Equipment teams, Process Development and Process Integration… more
- Micron Technology, Inc. (Boise, ID)
- …Process Control (SPC), defect analysis and data analysis + Experience in semiconductor process engineering and packaging with fundamental understanding of ... learn, communicate and advance faster than ever. **Department Intro:** The Advanced Packaging Technology Development (APTD) department at Micron Technology is at… more
- Micron Technology, Inc. (Boise, ID)
- …teams, supporting technology development across Planar DRAM, Advanced DRAM, and Advanced Packaging TD. As a Process Quality Engineer, you will be recognized ... and contribute to the growth and innovation of the semiconductor industry. The Process Quality Engineering (PQE)...facilitates new material integration (NMI) in close collaboration with Process Development and Process Integration… more
- Micron Technology, Inc. (Boise, ID)
- …Advanced Packaging functions. **What You'll Do** As a Workforce Development Engineer, you will: + Collaborate with engineering, manufacturing, and leadership to ... experience in semiconductor manufacturing, preferably in DRAM, HBM or Advanced Packaging . + Position level will be determined based on education and experience.… more
- NY CREATES (Albany, NY)
- …CSR, Tokyo Electron, Applied META Center, C4 and BAT facilities for HI and Packaging development . This position will develop and manage NY Creates portfolio of ... Engineering and management of the NY Creates Heterogeneous and Packaging Integration group in support of NY Creates 300mm...Own and drive NY Creates 3D and Heterogeneous Integration development in the Center for Semiconductor Research… more
- Micron Technology, Inc. (Richardson, TX)
- …Support multi-functional initiatives involving Build Engineering, Product Engineering, and Process Development . + Contribute to architectural decisions impacting ... high-performance computing and 2.5D/3D packaging . + Communicate technical findings and compose insights for...Previous internship or project experience in memory architecture or semiconductor development . As a world leader in… more
- Micron Technology, Inc. (Richardson, TX)
- …will be working with teams like Design Engineering (DE), Product Engineering (PE), Process Integration, Packaging and Technology Development (TD) on ... (Python, TCL, Perl). + Proven innovation and problem-solving in high-performance memory development . As a world leader in the semiconductor industry, Micron… more
- Micron Technology, Inc. (Richardson, TX)
- …will be working with teams like Design Engineering (DE), Product Engineering (PE), Process Integration, Packaging and Technology Development (TD) on ... reliability! HBM product family is growing due to high demand from industry leading semiconductor companies. As a HBM Memory Design Engineer in sustaining role you… more
- Teradyne (North Reading, MA)
- …of modern digital semiconductor development - design, DFT, fabrication process , packaging , and device testing + Basic understanding of datacenter and ... integrate and excel across segments, positioning Teradyne as the go-to provider in semiconductor testing. By partnering with a diverse range of customers - from… more
- Micron Technology, Inc. (Boise, ID)
- …implementation of new product concepts. Working closely with Product and Business Development Managers you will ensure that each technical decision is aligned with ... memory architectures, system memory hierarchy, and compute system architectures. + Exposure to packaging technologies such as TSV, stacked packaging , and 3D … more
- Micron Technology, Inc. (Boise, ID)
- …strategy and the engineering teams through forward-looking investigation and development of energy-efficient bandwidth solutions in support of sustained technology ... opportunities for, and drive, performance scaling through innovative circuit, signaling, packaging and interconnect solutions with a 3-5 year outlook, and to… more
- Micron Technology, Inc. (Boise, ID)
- …subject areas and organizations (eg, Signal Integrity, Circuit and Chip Design, Packaging R&D and System Integration)! **Responsibilities:** + Development of ... products like HBM, GDDR, LPDRAM, DDR5/DDR6, PCIeGen6 and sophisticated signaling development . We handle the interconnect and signaling exploration and development… more
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