- Micron Technology, Inc. (Folsom, CA)
- …will be responsible for crafting and analyzing high-speed IO circuits for DRAM & Interface die. This includes simulating, optimizing, and floor planning circuits. ... crafted for 3D-stacked synchronous dynamic random-access memory (SDRAM). HBM stacks multiple DRAM chips vertically, resulting in a compact form factor. It provides… more
Locations:
California