- Global Foundries (Malta, NY)
- …more information, visit www.gf.com . Summary of Role: This hands-on Package and chip assembly Engineering role will develop industry leading advanced packaging ... Photonics , there is also a strong need for Design/Integration/ assembly of Optical components and connectors. It is expected... assembly technologies for Photonic Packaging, including both chip assembly and optical solutions. + Assesses… more
- Cisco (San Jose, CA)
- …and key component partners, driving assembly , test, and qualification for silicon photonics packages. + Proactively identify and mitigate risks, resolve ... **Packaging Technical Leader - Silicon Photonics ** **The application window is...interface with Outsourced Semiconductor Assembly & Test (OSAT)… more
- NVIDIA (Santa Clara, CA)
- …products. Teams are dedicated to the architecture and design of CMOS and Silicon - Photonics high-speed chip interfaces (NVLink, IEEE, PCIE, USB, OIF) ... teams to optimize workflows, enhance cross-functional efficiency, and solve complex silicon photonics design problems across different technology nodes. +… more
- Cisco (Carlsbad, CA)
- …* Help define/improve standards and design rules (ie, design for manufacturing) for design and assembly of silicon photonics products * Work with product and ... photonics team on the integration of Cisco's silicon photonics into our automated, high-volume packaging...to seek modes of improvement that span from photonic chip design to optical assembly (ie, integration… more
- Texas Instruments (Dallas, TX)
- …implementation of innovative packaging solutions for cutting-edge optical products including silicon photonics ICs, optical engines, and co-packaging of optics. ... processes and approaches to meet system specifications including for advanced silicon photonics products.** + **Develop solutions for low-loss, low-cost… more
- Cisco (San Jose, CA)
- …to proactively identify and mitigate risks, resolve highly complex assembly issues, silicon -to-package interaction, system-level integration and establish ... packaging technologies (2.5D/3D, heterogeneous integration, large body packaging, MCM, flip- chip ) providing guidance and problem-solving expertise in areas such as… more
- Applied Materials (Santa Clara, CA)
- …global leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world. We design, build and service ... be working with a highly capable international team to develop advanced photonics packaging solution. You will lead optomechanical design, optical sub- assembly … more