- Micron Technology, Inc. (Boise, ID)
- …the Global Design , Simulations, & Substrate group responsible for driving chip package interaction (CPI) packaging design rules and test vehicle ... packaging projects as needed + Drive development of technical packaging solutions with package design and technology development partners to recommend the… more
- Micron Technology, Inc. (Boise, ID)
- …meet electrical, mechanical, thermal, and other system level requirements. + Coordinate package design and assembly of advanced 2.5D/3D packages, driving ... communicate and advance faster than ever. As an Advanced Packaging Senior Distinguished Member of Technical Staff in the...customers + Drive novel solutions with SoC architects, silicon design , and product teams to recommend the optimum … more
- Micron Technology, Inc. (Folsom, CA)
- …expanding team of domain experts across platforms, systems architecture, component design , and advanced packaging , you'll analyze platform architecture ... trade-offs in close collaboration with design and packaging teams. Your responsibilities will encompass the definition of SoC and IP architectures, evaluation… more
- Micron Technology, Inc. (Folsom, CA)
- …joining our expanding team of domain experts across platforms, systems architecture, component design , and advanced packaging , you will apply your deep knowledge ... of compute architecture, hardware architecture, and/or memory systems architecture to architect and optimize memory systems for AI. Our team vision is a continuing desire to develop your skills working in an inclusive diverse environment of multicultural Teams… more
Locations:
California,
Idaho