- Northrop Grumman (Linthicum, MD)
- …amplification, and switching on whole wafers and discrete semiconductor devices. **Assembly** + Wafer Saw: Dicing a wafer into individual, discrete ... of the production needs at ATL, a Solid State Technician will be assigned to one or more of...one or more of the following specific process areas: ** Wafer Fabrication** + Chemical Mechanical Planarization (CMP): Using a… more
- Lockheed Martin (Goleta, CA)
- …Process Engineer is responsible for sustaining/supporting III\-V and Si semiconductor wafer and packaging process areas, which may include photolithography, in\-line ... metrology, wet/dry etching, thin film deposition, substrate thinning, dicing , and flip\-chip bonding\. Assignments include the definition of processing and handling… more
Locations:
California,
Maryland