- Skyworks (Irvine, CA)
- Sr Principal, Wafer Bonding Integration Engineer Apply now " Date:Sep 23, 2024 Location: Irvine, CA, US Company: Skyworks If you are looking for a challenging ... 72535 Job Description Skyworks is seeking a highly skilled and experienced Wafer Bonding Integration Engineer . As a key member of our engineering team, you will… more
- Micron Technology, Inc. (Boise, ID)
- …than ever. Welcome! We at Micron Technology are seeking a Sr./Principal Equipment Development Engineer ( Wafer Bonding) to join our R&D Equipment team in Boise, ... to the area, if needed. As a Senior/Principal Equipment Development Engineer in TD's wafer bonding Tech Dev (TD) team, you will be primarily responsible… more
- Micron Technology, Inc. (Boise, ID)
- …communicate and advance faster than ever. Welcome! As a Process and Equipment Development Engineer in the NAND wafer thinning R&D team, you will be primarily ... requirements for Micron products. You will grow into an expert engineer , driving wafer thinning technology roadmaps, which have a direct influence on Micron's… more
- Micross Components (Triangle, NC)
- …our Process Engineering team. The internship will require extensive hands-on wafer processing in our cleanroom facilities with the successful candidate performing ... electroplating. The successful candidate should have some knowledge of wafer processes and basic device processing steps. Experience with...and PowerPoint + Cleanroom experience is a plus + Wafer processing experience is a plus Due to Micross… more
- Teledyne (Goleta, CA)
- …Our Detector Operations team produces both cooled and uncooled infrared detectors with a varied product mix ranging from low volume to one of the infrared world's ... highest volume. In a dynamic environment, you will help transition products from development to production, maintain processes, and actively work on continuous improvement. This will involve deep dives into process and equipment capabilities, analyzing data,… more
- Micron Technology, Inc. (Boise, ID)
- …inspiring the world to learn, communicate and advance faster than ever. As a Wafer Bonding Process Engineer you will be primarily responsible for starting up, ... of industry or R&D proven work experience specific to wafer level bonding (or an adjacent field). **Education:** :...**Education:** : PhD Degree with research work specific to wafer level bonding, or MS degree As a world… more
- Global Foundries (Malta, NY)
- …life-long connections and skills. Summary of Role: 3D Advanced Heterogeneous Integration Development Engineer which includes wafer to wafer hybrid bonding, ... with OSATs (Outsourced Assembly and Test) to develop new wafer level and die level 2.5D and 3D Heterogeneous...reduce cycle-time & costs. Generate IP related to novel wafer integration & packaging technology. + Drive end-to-end process… more
- Texas Instruments (Lehi, UT)
- …have a part in shaping it.** Texas Instruments is looking for an Entry Level Wafer Fab Manufacturing Technicians to join our team. In this role, you will perform ... fab to ensure all issues are solved appropriately and efficiently. Wafer Fab Manufacturing Technicians include Equipment Technicians, Process Technicians, and… more
- Texas Instruments (Lehi, UT)
- …TI will have a part in shaping it.** Texas Instruments is seeking Wafer Fab Manufacturing Technician Interns who will be responsible for performing troubleshooting ... + Good listener and excellent verbal and written communication skills **Why TI?** + Engineer your future. We empower our employees to truly own their career and… more
- RTX Corporation (Goleta, CA)
- …at Raytheon Vision Systems is searching for an Infrared Semiconductor Product Engineer with semiconductor wafer processing, team stakeholder and project ... Position Role Type: Onsite Posting Title: Infrared Semiconductor Product Engineer At Raytheon, the foundation of everything we do...manufacture and test of SCAs at the RVS Goleta wafer /SCA fabrication facility. What You Will Do + Developing… more
- Medtronic (Plymouth, MN)
- …and usually responsible for entire device manufacturing operations other than wafer fabrication. Systems Engineer + Performs technical planning, system ... examples of work in each of these areas are listed below. R&D Engineer + Designs, develops, analyzes, troubleshoots and provides technical skills during research… more
- Micron Technology, Inc. (Boise, ID)
- …detailed physical requirements for Micron products. You will grow into an expert engineer , driving post probe wafer and assembly technology roadmaps, which have ... learn, communicate and advance faster than ever. **Equipment Development Engineer - Advanced Packaging Technology Development** As an Equipment...and optimizing next generation, first of a kind (FAOK) wafer and die equipment (Post probe wafer … more
- Micron Technology, Inc. (Boise, ID)
- …detailed physical requirements for Micron products. You will grow into an expert engineer , driving post probe wafer and assembly technology roadmaps, which have ... and advance faster than ever. As an **Sr./Principal Equipment Development Engineer ** in Micron's Advanced Technology Packaging Development (APTD) team, you will… more
- Northrop Grumman (Apopka, FL)
- …The devices supported in Apopka will also be subjected to singulation and die/ wafer probe testing. The Associate Process Engineer will support and sustain ... Mission Systems seeks a talented and motivated **Microelectronics Associate Process Engineer ** for our Advanced Packaging Technology u-Line in **Apopka, Florida** .… more
- Northrop Grumman (Linthicum, MD)
- …responsible for all aspects of semiconductor technology including design, mask making, wafer fabrication, testing, and assembly. The ** Engineer Circuit Design** ... or Java + Experience designing test procedures with LabView **Preferred Qualifications for Engineer Circuit Design:** + Experience with wafer or die testing. +… more
- Applied Materials (Albany, NY)
- …META Center on the UAlbany-NY Creates Nanotech Complex. Key technology areas of experience: wafer to wafer bonding - including fusion and hybrid bonding, complex ... heterogeneous wafer level packaging, TSV, die to wafer bonding, advanced substrate and chip on wafer stacking. **Key Responsibilities** **Prefer a PhD in… more
- Micron Technology, Inc. (Boise, ID)
- …group is seeking a Member of Technical Staff or Principal Process Development Engineer to join a growing team of Technology Development (TD) engineers responsible ... and transferring manufacturing capable solutions for future interconnect and wafer and die level processing applications. Come join us...Come join us and become the owner of several wafer level process steps and develop next generation processes… more
- L3Harris (Mason, OH)
- …the Focal Plane Array team at our Mason, OH location. As a Semiconductor Process Engineer , you will support a variety of wafer fabrication tools and processes, ... Job Title: Specialist Manufacturing Engineer Job Code: 10986 Job Location: Mason, OH...analysis. Essential Functions: + Qualify, setup, and operate semiconductor wafer equipment in a manufacturing environment + Perform DOEs… more
- L3Harris (Palm Bay, FL)
- Job Title: Technologist, 3D Semiconductor Integration and Advanced Packaging Engineer Job Code: 16213 Job Location: Palm Bay, FL Job Schedule: 9/80 (Every other ... silicon interposers, and other applications utilizing high density interconnect such as wafer -to- wafer and die-to- wafer stacking. This key role will provide… more
- Micron Technology, Inc. (Boise, ID)
- …and advance faster than ever. Micron is seeking a Global Front End SIC Engineer to join our dedicated team in our Boise, Idaho location! In this position, ... the site Inventory Managers. + Fluent in the basic concept of weekly wafer starts and wafer outs business process. + Network support to improve and support BIC… more
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