- Micron Technology, Inc. (Boise, ID)
- …various groups including C-SAM (C-mode scanning acoustic microscope), PYE (Product Yield Enhancement ), Product Engineering, Package Reliability, and AQL ... and advance faster than ever. **DEM Product Qual EFA Engineer ** As a DEM (DRAM and Emerging Memory) Product...Supplemental Tasks + Submit package level physical failure analysis ( PFA ) + Provide FA for other groups as requested… more
Locations:
Idaho