- Belcan (Hudson, NH)
- Microwave Engineer III Job Number: 353077 Category: Materials Engineering Description: Job Title: Microwave Engineer III Location: Hudson, NH Zip ... play a crucial role in the design, development, and implementation of microwave systems and components used in radar, communication, and electronic warfare systems.… more
- BAE Systems (Nashua, NH)
- …your career with BAE Systems. BAE Systems is seeking a Senior Principal Semiconductor Engineer to join the Advanced Microwave Product Center (located in Nashua, ... environment. A strong background in semiconductor process integration as related to III -V materials is highly desired. In-depth knowledge of GaN RF devices and… more
- BAE Systems (Nashua, NH)
- …and monitor daily production activities. BAE Systems is seeking a Principal Semiconductor Engineer to join the Advanced Microwave Product Center (located in ... fields and 3 years of work experience + Hands-on experience in III -V semiconductor inBackside processing, new tool install and qualification, and process improvement… more
- MIT Lincoln Laboratory (Lexington, MA)
- …with applications in quantum computing, atomic systems, advanced laser sources, microwave photonics, communications, sensing, and other areas of interest to the ... lab system. * Compound Semiconductor Laboratory (CSL): Facilities housing III -V and non-silicon material growth (molecular beam epitaxy (MBE), metalorganic… more
- MIT Lincoln Laboratory (Lexington, MA)
- …with applications in quantum computing, atomic systems, advanced laser sources, microwave photonics, communications, sensing, and other areas of interest to the ... lab system. * Compound Semiconductor Laboratory (CSL): Facilities housing III -V and non-silicon material growth (molecular beam epitaxy (MBE), metalorganic… more
- Insight Global (Chelmsford, MA)
- …RFIC design and HFSS Detailed transistor-level knowledge of RF and microwave circuit design techniques including linear power amplifier design; high-efficiency power ... and up to 3 years' experience in RFIC layout and tape-out, using III -V HBT, III -V HEMT, Si CMOS, SOI, and/or BiCMOS technologies; circuit and EM simulation in… more