- Micron Technology, Inc. (Boise, ID)
- …faster than ever. As a Process Development Engineer in Micron's Advanced Technology Packaging Development (APTD) team, you will be primarily ... include support of the manufacturing line and enablement of advanced automation and data collection techniques. You will be...+ Experience in wafer bonding, plating, warpage control and packaging process development and understanding… more
- Micron Technology, Inc. (Boise, ID)
- …our Wafer Level Packaging Technologies Team in Boise, Idaho. As an Advanced Package TD Process Integration Engineer at Micron, you will define technology ... requirements, build program plans, and secure resources to drive process technology development programs. More specifically, develop...and Skills** + At least 5 years experience in advanced packaging industry + Degree/Major: MS or… more
- Micron Technology, Inc. (Boise, ID)
- …and equipment interactions. Experience in wafer bonding, plating, warpage control and packaging process development and understanding of related ... faster than ever. As an **Sr./Principal Equipment Development Engineer** in Micron's Advanced Technology Packaging Development (APTD) team, you will be… more
- Micron Technology, Inc. (Boise, ID)
- …join our Wafer Level Packaging Technologies Team in Boise, Idaho. As an Advanced Package TD Process Integration Intern at Micron, you will work with ... define technology requirements, build program plans, and secure resources to drive process technology development programs. You will help develop sophisticated… more
- Micron Technology, Inc. (Boise, ID)
- …inspiring the world to learn, communicate and advance faster than ever. As an Advanced Packaging Senior Distinguished Member of Technical Staff in the Compute ... and Networking Business Unit (CNBU), you will lead Micron's Advanced Packaging strategy and drive innovation to ensure a leadership portfolio and best in class… more
- Micron Technology, Inc. (Boise, ID)
- …a Part Operations Engineer, you will have a vital role in our Technology Development department. You will be in charge of coordinating, analyzing, and optimizing the ... + Preferred: Hands on understanding of the semiconductor manufacturing process in regards to capacity planning, automation, scheduling, cycle time… more
- Micron Technology, Inc. (Boise, ID)
- …Bandwidth Memory (HBM) manufacturing, TSV, CoW, CSP, fan-out, fan-in and other advanced packaging technologies. **Qualifications** : + Proficient in English ... advance faster than ever. As a Compute DRAM Technical Packaging Manager for the Package Development Engineering...issues to Company Executives + Deep knowledge of Assembly Process , Equipment, Materials and Integration As a world leader… more
- Micron Technology, Inc. (Boise, ID)
- …MCP, and SSD. The three main responsibilities are: Closely partnering with the Advanced Package Technology Development and Package Development Engineering ... interactions, and ensuring they are addressed during the design and development phase of the product life cycle. Executing package reliability qualification… more
- Micron Technology, Inc. (Boise, ID)
- …our Wafer Level Packaging Technologies Team in Boise, Idaho. As an Advanced Package TD Process Integration Engineer at Micron, you will define technology ... requirements, build program plans, and secure resources to drive process technology development programs. More specifically, you...and Skills:** + At least 5 years experience in advanced packaging industry + Deep knowledge … more
- Micron Technology, Inc. (Boise, ID)
- …Physics, Materials, or a related field + At least 8 years' experience in Advanced Packaging Industry + Deep knowledge of Advanced Package Integration ... Team in Boise, Idaho. **OUR OPPORTUNITY SUMMARY** As an Advanced Package TD Process Integration Engineer at...requirements, build program plans, and secure resources to drive process technology development programs. More specifically, you… more
- Micron Technology, Inc. (Boise, ID)
- …in semiconductor package design, manufacturing or Q&R + Experience with advanced packaging technologies (eg, 3DI, Wafer-2-Wafer, SiP) **Qualifications** + ... on advanced memory solutions. You will work with Technology Development and Engineering teams to ensure that Chip-Package Interaction risks are understood… more
- Micron Technology, Inc. (Boise, ID)
- …reliability performance goals. + Support package architecture definition for advanced packaging projects as needed + Drive development of technical ... and NPI needs for flip chip products on advanced process nodes. This role offers an...packaging solutions with package design and technology development partners to recommend the optimum design criteria to… more
- ePac Flexible Packaging (Boise, ID)
- …articulating the value of our short run and quick turnaround digital flexible packaging solution and the problems we solve for our customers, leading/managing a ... sales process and winning new customer deals. Each Sales Executive...$70k+ commissions depending on skills and experience. ePac Flexible Packaging is a global flexible packaging company… more
- Norstella (Boise, ID)
- …brands to help clients navigate the complexities at each step of the drug development life cycle -and get the right treatments to the right patients at the ... via our market-leading brands, we help our clients: + Citeline - accelerate the drug development cycle + Evaluate - bring the right drugs to market + MMIT - identify… more
- Micron Technology, Inc. (Boise, ID)
- …field of study **Required Qualifications:** + Familiarity with semiconductor wafer fabrication, advanced packaging , and semiconductor device physics. + 3 years ... + Collaboratively develop and establish reliability targets and standards with technology development and product engineering teams + Comprehend new wafer fab and … more
- Micron Technology, Inc. (Boise, ID)
- …field of study **Required Qualifications:** + Familiarity with semiconductor wafer fabrication, advanced packaging , and semiconductor device physics. + 3 years ... + Cooperatively develop and establish reliability targets and standards with technology development and product engineering teams + Comprehend new wafer fab and … more
- Micron Technology, Inc. (Boise, ID)
- …High-Bandwidth Memory (HBM) solutions fueling generative AI and next generation advanced packaging solutions. By establishing a strategic partnership with ... on investments and shareholder value. You will partner with the DRAM Technology Development (TD) and Heterogeneous Integrated Group (HIG). The DRAM TD team is… more
- Johnson Thermal Systems (Caldwell, ID)
- …Thermal Systems (JTS) is the largest and leading provider of Power Packaging , Power Distribution Centers, and Industrial Refrigeration Units.We are proud to be ... convert custom specifications into drawings and schematics for the manufacturing process of unique customer electrical equipment. The Electrical Engineer will… more
- CAI (Boise, ID)
- …and processes for improvement and expansion + Implement and enhance an advanced CI/CD solution. Develops, codes, tests, builds, installs, configures, and maintains ... and recoverability + Proven ability and experience designing and implementing advanced automation solutions using tools such as Terraform, Terragrunt, Ansible… more