- Micron Technology, Inc. (Boise, ID)
- …ever. **Micron Technology is searching for its next Product Pathfinding Engineer on the High Bandwidth Memory ( HBM ) technology team!** In this role you ... DRAM solutions! Additionally, implementation of innovative 2.5D and 3D solutions, including HBM , from an electrical and packaging standpoint. Product Engineers… more
- Micron Technology, Inc. (Boise, ID)
- …world-wide advanced packaging team responsible for next generation high bandwidth memory ( HBM ) pathfinding and development. You will be responsible for ... at Micron Technology are seeking a CMP Process Development Engineer (Packaging) to join us at our R&D global...for starting up, developing and optimizing processes to improve product quality and reliability, working on process yield improvement,… more