- Siemens Digital Industries Software (Fremont, CA)
- …performing individual for an opportunity to serve as the package design lead in our 3D IC Solutions Engineering team in driving the development of ... components (excluding the chiplet devices). Additional responsibilities include working with the 3D IC Solutions teams in integrating the other 3D … more
- Meta (Menlo Park, CA)
- …17. Experience with optical integration including InP PICs, Silicon-photonic PICs, PIC- IC integration, and 3D optical packaging technologies. **Public ... mission of bringing the world together. We are looking for an Optical Engineer to qualify optical communications modules for Meta's cutting-edge, global, data center… more