- Micron Technology, Inc. (Boise, ID)
- …and advance faster than ever. As an **Sr./Principal Equipment Development Engineer ** in Micron's Advanced Technology Packaging Development ( APTD ) team, you ... generation, first of a kind (FAOK) wafer and die equipment (Post probe wafer and die development) to improve...and sub-component development, all the way to implementation in APTD and manufacturing facilities. You will also be required… more
- Micron Technology, Inc. (Boise, ID)
- … - Advanced Packaging Technology Development** As an Equipment Development Engineer in Micron's Advanced Technology Packaging Development ( APTD ) team, you ... generation, first of a kind (FAOK) wafer and die equipment (Post probe wafer and die development) to improve...and sub-component development, all the way to implementation in APTD and manufacturing facilities. You will also be required… more