- Micron Technology, Inc. (Boise, ID)
- …the world to learn, communicate and advance faster than ever. As a Process Integration engineer in the 3D DRAM organization, you will be part of ... Micron's cutting-edge next-generation memories. Areas of concentration will include integration and circuit issues specific to 3D ...DRAM technology. In addition to a broad basis of process integration knowledge, this position will require… more
- Micron Technology, Inc. (Boise, ID)
- …because doing so can fuel the very innovation we are pursuing. As a process integration engineer in the 3D DRAM organization, you will join a team of ... to 3D DRAM technology. In addition to a broad basis of process integration knowledge, this position requires a strong background in materials science… more
- Micron Technology, Inc. (Boise, ID)
- …the world to learn, communicate and advance faster than ever. As a 3D NAND process integration engineer , you will take ownership of one or more ... modules related to the development and operation of a 3D NAND semiconductor integrated circuit. Set up structural specs...execute device and process experiments to perform process development and process integration .… more
- Micron Technology, Inc. (Boise, ID)
- …integrity, accountability, and professionalism while supporting our global community. As a NAND Process Integration Intern Engineer at Micron Technology you ... be responsible for executing tasks related to memory device process integration . The tasks may involve crafting...major memory and storage technologies: DRAM, NAND, NOR and 3D XPoint (TM) memory. Our solutions are purpose built… more
- Micron Technology, Inc. (Boise, ID)
- …faster than ever. Are you ready to enrich life for all? As a Wet Process Development Principal Engineer or Senior Member of Technical Staff (SMTS), you will ... be part of a groundbreaking 3D DRAM research and development Wet Process ...+ 5 plus years of experience working as a process development engineer in aR&D environment preferred… more
- Micron Technology, Inc. (Boise, ID)
- …This opportunity is open to global candidates and applicants. As a CMP Packaging Process Engineer within our Technology Development division, you will be part of ... Micron to develop cutting edge memory technology. As a Process Engineer you will be primarily responsible... development and equipment related experience required + Prior integration experience of 3D TSV, micro-bumps, temporary… more
- WSP USA (Boise, ID)
- …a search for a Full-Time Lead Consultant - Fire and Life Safety Engineer . for our **San Diego office.** Other locations considered. Be involved in projects ... design, concept development, planning, installation, operation, maintenance, and optimal integration of automatic sprinkler, fire alarm, mass notification systems,… more
- Micron Technology, Inc. (Boise, ID)
- …(eg, Signal Integrity, Circuit and Chip Design, Packaging R&D and System Integration ). **Qualifications** + PhD w/5 years of industry experience or MSEE w/10 ... Background + Strong Mixed-signal Circuit Design Background + Hands on knowledge of 3D EM field solvers, Matlab, time and frequency domain simulation tools like HFSS,… more
- Micron Technology, Inc. (Boise, ID)
- …while rapidly growing your abilities **In our hybrid role,** as a Product Pathfinding Engineer on the High Bandwidth Memory (HBM) technology team, you will be tasked ... Near Memory DRAM solutions! Additionally, implementation of innovative 2.5D and 3D solutions, including HBM, from an electrical and packaging standpoint. Product… more