- Micron Technology, Inc. (Boise, ID)
- …inspiring the world to learn, communicate and advance faster than ever. As a wafer bonding process engineer within our DRAM Technology Development ... a world-wide memory development organization. You will be responsible for developing wafer bonding process technology which will enable Micron to develop… more
- Micron Technology, Inc. (Boise, ID)
- …years of semiconductor process or equipment engineering experience, preferably in wafer bonding , plating, warpage control and packaging field Experience in ... of post probe and assembly process and equipment interactions. Experience in wafer bonding , plating, warpage control and packaging process development… more
- Micron Technology, Inc. (Boise, ID)
- …handling, loading of lots, and system requests across CMP, WET, ETCH, PHOTO, CVD, bonding , debonding, TCD, wafer preparation, hybrid bonding , pre- and ... manufacturing processes and equipment, including CMP/ WET / ETCH/ PHOTO/ CVD/ bonding / debonding/ TCD/ wafer preparation/ hybrid bonding / encapsulation… more