• 2nd shift Die Bond / Wire…

    Mercury Systems (Phoenix, AZ)
    …and routine electronic assembly operations on components or subassemblies * Technical Knowledge of Die attach, Wire bond , Epoxy Dispense, Flipchip, Wafer ... electronic assembly operations on components or subassemblies * Technical Knowledge of Die attach, Wire bond , Epoxy Dispense, Flipchip, Wafer Die Eject,… more
    Mercury Systems (12/09/24)
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