• IP Integration Lead Engineer

    Broadcom (Fort Collins, CO)
    …a Candidate Account, please Sign-In before you apply.** **Job Description:** Broadcom's ASIC Product Division (APD) is focused on enabling customers to develop ... of a cross functional design team developing die-to-die PHY IP . The die-to-die PHYs are used broadly in APD's...die-to-die PHYs are used broadly in APD's custom silicon ASIC products. The successful candidate will be involved in… more
    Broadcom (12/03/24)
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  • HBM Memory Applications Engineer

    Broadcom (Fort Collins, CO)
    …a Candidate Account, please Sign-In before you apply.** **Job Description:** Broadcom's ASIC Product Division (APD) is focused on enabling customers to develop ... skilled _Applications Engineer_ providing first class customer support for custom silicon ASIC products that integrate Broadcom's High Bandwidth Memory (HBM) PHY … more
    Broadcom (12/03/24)
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  • Firmware Development Engineer

    Broadcom (Fort Collins, CO)
    …a Candidate Account, please Sign-In before you apply.** **Job Description:** Broadcom's ASIC Product Division (APD) is focused on enabling customers to develop ... firmware for Broadcom's proprietary High Bandwidth Memory (HBM) PHY IP , as well as die-to-die interconnect PHY IP..., which are used broadly in our custom silicon ASIC products. This individual must be highly motivated and… more
    Broadcom (12/03/24)
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  • IC Package Mechanical FEA Engineer (R&D)

    Broadcom (Fort Collins, CO)
    …before you apply.** **Job Description:** Job Description **IC Package Mechanical FEA** ** Engineer (R&D)** Broadcom is seeking an experienced package mechanical FEA ... engineer for very-large and complex packages for industry-leading ASICs....have exposure to emerging package integration technologies, such as co -packaged fiber-optic transceivers and connectors and complex chip stacking… more
    Broadcom (11/01/24)
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  • Package Design Engineer

    Broadcom (Fort Collins, CO)
    …**Job Description:** Broadcom is seeking an experienced package design engineer for complex flip-chip-BGA packages for industry-leading ASICs with high-speed ... 224G and higher, 5G RF/Microwave ADC/DAC, HBM, DDR5 and more. You'll have the opportunity to collaborate with the team to create the package structures needed to… more
    Broadcom (11/20/24)
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