• Packaging Engineer E5

    Applied Materials (Santa Clara, CA)
    …cross functional team responsible for developing new modules in Advanced Semiconductor Packaging . Key attributes of a successful candidate: + Domain expertise in W2W ... hybrid and fusion bonding with deep understanding of materials, process device physics and integration. + Ability to drive new materials and process development to enable 3D NAND pitch scaling through structured problem solving methodology. + Proven track… more
    Applied Materials (10/22/24)
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