- Micron Technology, Inc. (Boise, ID)
- …the Global Design , Simulations, & Substrate group responsible for driving chip package interaction (CPI) packaging design rules and test vehicle ... packaging projects as needed + Drive development of technical packaging solutions with package design and technology development partners to recommend the… more
- Micron Technology, Inc. (Boise, ID)
- …meet electrical, mechanical, thermal, and other system level requirements. + Coordinate package design and assembly of advanced 2.5D/3D packages, driving ... communicate and advance faster than ever. As an Advanced Packaging Senior Distinguished Member of Technical Staff in the...customers + Drive novel solutions with SoC architects, silicon design , and product teams to recommend the optimum … more