- Micron Technology, Inc. (Boise, ID)
- …advance faster than ever. Responsibilities will include: * Develop, diagnose and resolve packaging process related problems for Die and Wafer bonding related ... projects * Coordinate and execute process , equipment and material evaluation / optimization initiatives and...degree + 5(+) years of industry experience specific to Advanced Packaging and wafer-to-wafer bonding. As a… more
- Micron Technology, Inc. (Boise, ID)
- …learn, communicate and advance faster than ever. As a Process Development Engineer in Micron's Advanced Technology Packaging Development (APTD) team, you ... field + Experience in wafer bonding, plating, warpage control and packaging process development and understanding of related inline/electrical/probe failure. +… more
- Micron Technology, Inc. (Boise, ID)
- …to join our Wafer Level Packaging Technologies Team in Boise, Idaho. As an Advanced Package TD Process Integration Engineer at Micron, you will define ... across domains **Qualifications and Skills** + At least 5 years experience in advanced packaging industry + Degree/Major: MS or Ph.D. in Electrical, Computer… more
- Micron Technology, Inc. (Boise, ID)
- …communicate and advance faster than ever. As an **Sr./Principal Equipment Development Engineer ** in Micron's Advanced Technology Packaging Development (APTD) ... interactions. Experience in wafer bonding, plating, warpage control and packaging process development and understanding of related inline/electrical/probe… more
- Micron Technology, Inc. (Boise, ID)
- …is leading the way in transforming global information usage. As a Part Operations Engineer , you will have a vital role in our Technology Development department. You ... + Preferred: Hands on understanding of the semiconductor manufacturing process in regards to capacity planning, automation, scheduling, cycle time… more
- Micron Technology, Inc. (Boise, ID)
- …HBM nodes. The modeling engineer will collaborate extensively with PI, process , and packaging teams for Multiphysics and multiscale model development, ... learn, communicate and advance faster than ever. As an Advanced Modeling Sr. Engineer at Micron, you...generate useful insights and solutions. You will interact with process engineers and PI teams to identify questions and… more
- Micron Technology, Inc. (Boise, ID)
- …to join our Wafer Level Packaging Technologies Team in Boise, Idaho. As an Advanced Package TD Process Integration Engineer at Micron, you will define ... requirements, build program plans, and secure resources to drive process technology development programs. Your development focus will also...related field + At least six years' experience in Advanced Packaging Industry + Deep knowledge of… more
- Johnson Thermal Systems (Caldwell, ID)
- …manufacturing process of unique customer electrical equipment. The Electrical Engineer will utilize SolidWorks and AutoCAD software. This individual will be the ... Electrical Engineer Caldwell, ID Full Time Mid Level Share...(JTS) is the largest and leading provider of Power Packaging , Power Distribution Centers, and Industrial Refrigeration Units.We are… more
- Micron Technology, Inc. (Boise, ID)
- …field of study **Required Qualifications:** + Familiarity with semiconductor wafer fabrication, advanced packaging , and semiconductor device physics. + 3 years ... and creativity to deliver efficient and effective solutions. As a Principal Engineer in Product Quality and Reliability Assurance (PQRA) at Micron Technology, Inc.,… more
- Micron Technology, Inc. (Boise, ID)
- …field of study **Required Qualifications:** + Familiarity with semiconductor wafer fabrication, advanced packaging , and semiconductor device physics. + 3 years ... and creativity to deliver efficient and effective solutions. As a Senior Engineer in Product Quality and Reliability Assurance (PQRA), you will support reliability… more