- Micron Technology, Inc. (Boise, ID)
- …for developing each new generation of DRAM memory as it transitions from the design stage to mass production. Serve as the key interface between Research and ... Development, Manufacturing, Marketing, and Quality Assurance departments. Perform wafer and component level circuit debugging. Perform device characterization for improved operation and testability. Perform detailed DRAM analysis to maximize end-user… more
- Micron Technology, Inc. (Boise, ID)
- …platforms. Your role involves collaborating with a diverse group of experts in Design Engineering, Product Engineering, Process Development, and more to develop ... how the world uses information. The role of a High Bandwidth Memory ( HBM ) System Engineering Intern at Micron Technology, Inc. provides an opportunity to advance… more
- Micron Technology, Inc. (Boise, ID)
- …that is dedicated solely to competitive analysis through collaboration with DE ( Design ), PE ( Product Engineering), and TD (Technology Development) across ... company! This role is critical in evaluating and benchmarking the design strategies of competitor DRAM products including Compute, Mobile, Graphic and HBM ,… more
- Micron Technology, Inc. (Boise, ID)
- …plus. + Knowledge of CMOS ITF and interconnect Modeling. + Familiarity with memory design preferred (DDR3/4/5, LP3/4/5, HBM , NAND) + Knowledge of CMOS devices, ... to learn, communicate and advance faster than ever. The Senior/Principal CAD Engineer - Physical Verification is a technical role within the Engineering Automation… more
- Micron Technology, Inc. (Boise, ID)
- …than ever. Welcome! We at Micron Technology are seeking a CMP Process Development Engineer (Packaging) to join us at our R&D global headquarters in Boise, ID! ... is open to global candidates and applicants. As a CMP Packaging Process Engineer within our Technology Development division, you will be part of our world-wide… more
- Micron Technology, Inc. (Boise, ID)
- …high speed product signaling and power designs for products like HBM , GDDR, LPDRAM, DDR5/DDR6, PCIeGen6 and sophisticated signaling development! We handle the ... multiple disciplines and organizations (eg, Signal Integrity, Circuit and Chip Design , Packaging R&D and System Integration). **Qualifications** + PhD w/5 years… more