• IC Package Mechanical

    Broadcom (San Jose, CA)
    …a Candidate Account, please Sign-In before you apply.** **Job Description:** Job Description ** IC Package Mechanical FEA ** **Engineer (R&D)** Broadcom ... is seeking an experienced package mechanical FEA engineer for very-large and complex packages for industry-leading ASICs. You will be part of a worldwide R&D… more
    Broadcom (11/01/24)
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  • IC Reliability Engineer

    NVIDIA (Santa Clara, CA)
    …What you will be doing: + Reliability (DfR) qualification and testing for various packaging including GPU/CPU, power model, memory IC , wifi module and etc. + ... RMA data as compared to testing data; + Perform FEA to assist PCBA and system mechanical ...packaging and modules + Knowledge using DfR and FEA tools is desired + Strong familiarity with statistics… more
    NVIDIA (11/03/24)
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  • ASIC Packaging Engineer

    Meta (Menlo Park, CA)
    … physical behavior 8. Responsible for designing robust and reliable mechanical package architecture **Minimum Qualifications:** Minimum Qualifications: 9. ... **Summary:** Meta is looking for an experienced ASIC Packaging Engineer, Mechanical /Thermal modeling focus for...IC structural concept and for lided or lidless package 14. Proven fundamentals in the electrical/material/thermal or … more
    Meta (11/14/24)
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  • Principal Engineer, Packaging Engineering

    Western Digital (Milpitas, CA)
    …design of experiment, and testing, whichever comes first for best engineering practice, of mechanical responses of IC package and flash products including ... Solid knowledge through academic coursework or experience required in mechanical engineering of IC packaging ...conducting mechanical testing and/or using a commercial FEA package . + Good understanding of general… more
    Western Digital (11/16/24)
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  • Mechanical Engineering Internship - Summer

    Qualcomm (Santa Clara, CA)
    …are looking to have the opportunity to work within areas of signal integrity, IC packaging , high performance chip/ package CPI analysis, power integrity, ... Solid Mechanics, Mechanics of Materials and Finite Element Analysis ( FEA ) + Knowledge in Mechanical design, heat... design, heat transfer, microelectronics device. + Knowledge of IC packaging structures, chip- package , electronic… more
    Qualcomm (11/19/24)
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