- Google (Sunnyvale, CA)
- …in post silicon bring up or model correlation. Preferred qualifications: + Experience in signal and power integrity for various high speed interconnects (eg, ... will be responsible for the chip package design with signal / power integrity simulation and characterization...Design, software team and vendors. You will drive chip packaging signal and power implementations… more
- Siemens Digital Industries Software (Fremont, CA)
- …self-starting, motivated, and high performing individual for an opportunity to serve as the Signal / Power Integrity Analysis Lead in our 3D IC Solutions ... to drive the development of workflows to support the signal and power integrity analysis...Cadence (Assura, QRC, Hyperextract) + Working knowledge of Advanced Packaging IC EDA tools and design methods including: o… more
- Cisco (San Jose, CA)
- …You will also collaborate with packaging and hardware design team to ensure signal and power integrity specifications are met. Who you'll work with: ... plus: Passive component design: inductors, -transformers, transmission-lines, etc. -Floorplanning ( power /ground, digital/analog signal routing, etc.) -Custom transistor… more
- NVIDIA (Santa Clara, CA)
- …a senior team member, you will collaborate closely with other System/SW Architects, Signal Integrity / Packaging experts and Product engineers to understand ... We are looking for a Senior Applied Power Architect - GPU. NVIDIA is known as...technologies and come up with innovative solutions to address packaging , interconnect, physical design, electrical and thermal challenges. +… more
- Lightmatter (Mountain View, CA)
- …will lead and manage a multi-physics engineering team across various domains from Signal / Power Integrity , Photonics, Mechanical, and Thermals to develop ... domain expertise in at least one the following fields: Signal / Power Integrity , Thermals, Mechanical Design,...analysis team + Proven experience and knowledge of semiconductor packaging technologies; General understanding of 2D/2.5D & 3D … more
- Teledyne (Mountain View, CA)
- …tools such as MWO, ADS, HFSS, Sonnet, Spice, or Cadence. + Knowledge of signal routing and packaging technologies for devices and subassemblies. + Ability to ... Design Engineering team in the design and development of complex solid-state power amplifiers (SSPAs) and multi-function modules (MFMs) for defense and space… more
- Siemens Digital Industries Software (Fremont, CA)
- …Interposer, Organic Package) o Package Design Cadence (APD/SiP), Siemens (XSI/XPD) o Signal / Power integrity analysis: Siemens (HyperLynx SI/PI), Ansys ... advanced 2.5 and/or 3D Package design methods and advanced packaging technologies + Detailed knowledge of EDA data formats...and ATE test support. + Working knowledge of Advanced Packaging IC EDA tools and design methods including: o… more
- Siemens Digital Industries Software (Fremont, CA)
- …Interposer, Organic Package) o Package Design Cadence (APD/SiP), Siemens (XSI/XPD) o Signal / Power integrity analysis: Siemens (HyperLynx SI/PI), Ansys ... Additional understanding of general Physical IC design and/or IC packaging tools and concepts is favorable, including: o Place...test support a plus + Working knowledge of Advanced Packaging EDA tools and design methods including: o 2.5D… more
- Siemens Digital Industries Software (Fremont, CA)
- …Interposer, Organic Package) o Package Design Cadence (APD/SiP), Siemens (XSI/XPD) o Signal / Power integrity analysis: Siemens (HyperLynx SI/PI), Ansys ... (IC/3DIC/Custom Compiler), Cadence (SoC Encounter, Innovus, Virtuoso) + Working knowledge of Advanced Packaging EDA tools and design methods a plus: o 2.5D and 3D… more
- Siemens Digital Industries Software (Fremont, CA)
- …Interposer, Organic Package) o Package Design Cadence (APD/SiP), Siemens (XSI/XPD) o Signal / Power integrity analysis: Siemens (HyperLynx SI/PI), Ansys ... verification experience + Working knowledge (3-5 years of experience preferred) of Advanced Packaging IC EDA tools and design methods including: o 2.5D and 3D… more