• 3D IC Solutions

    Siemens Digital Industries Software (Wilsonville, OR)
    …performing individual for an opportunity to serve as the package design lead in our 3D IC Solutions Engineering team in driving the development of ... components (excluding the chiplet devices). Additional responsibilities include working with the 3D IC Solutions teams in integrating the other 3D more
    Siemens Digital Industries Software (08/25/24)
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  • BESS Enclosure Design- Mechanical Design Sr.…

    Celestica (Portland, OR)
    …and maintains existing designs. Research mechanical concepts and create system solutions using 3D modeling and simulation software. Complete calculations ... Mechanical **SAP Short Name:** SSE-ENG-DME **Job Level:** Level 11 ** IC /MGR:** Individual Contributor **Direct/Indirect Indicator:** Indirect **Summary** The Staff … more
    Celestica (07/09/24)
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