- Global Foundries (Malta, NY)
- …to network with executives. Summary of Role: Intern engineering student to contribute to 3D Advanced Heterogeneous Integration Development which includes ... verbal communication skills + Strong planning & organizational skills + Any Advanced Semiconductor Packaging or Semiconductor Integration experience a big plus… more
- Global Foundries (Malta, NY)
- Summary of Role: 3D Advanced Heterogeneous Integration Development Engineer which includes wafer to wafer hybrid bonding, die to wafer hybrid bonding, ... the tools & materials for the Malta Fab 8 Advanced Semiconductor fab . + Collaborate with OSATs (Outsourced...develop new wafer level and die level 2.5D and 3D Heterogeneous Integration processes. +… more
- Broadcom (Irvine, CA)
- …Package Technology Development expert to drive innovations in advanced substrates, heterogeneous integration with 2.5D/ 3D assembly and advanced ... + 10+ years of experience in advanced substrates and 2.5D & 3D integration + Ability to work in a fast-paced, cross-functional environment with deep thinking… more
- Meta (Sunnyvale, CA)
- …Perform design analysis and what-if scenarios for novel packaging schemes such as 2.5D/ 3D and heterogeneous integration to improve bandwidth, power ... Silicon Packaging Design Engineer Responsibilities: 1. Perform package design for advanced custom silicon comprising single-chip/multi-chip and 3D or wafer… more
- Micron Technology, Inc. (Dallas, TX)
- …Micron's HBM product portfolio. In HBM HIG (High Bandwidth Memory - Heterogeneous Integration Group), we innovate and integrate end-to-end groundbreaking ... , high-speed interface design, high-performance computing architectures, and 2.5D & 3D package integration to understand and analyze bottlenecks and… more