- Global Foundries (Malta, NY)
- …which give our new team members life-long connections and skills. Summary of Role: 3D Advanced Heterogeneous Integration Development Engineer which ... the tools & materials for the Malta Fab 8 Advanced Semiconductor fab and Fishkill PDL (Packaging Differentiation Line)....develop new wafer level and die level 2.5D and 3D Heterogeneous Integration processes. +… more
- Micross Components (Durham, NC)
- Summary: This position will support the Micross 3D Heterogeneous Integration program areas, including: + Development of semiconductor advanced packaging ... processing (eg MEMS or other post-CMOS processing). Experience in advanced packaging and/or 3D integration processes is desired. Essential Duties &… more
- The University of Texas at Arlington (Arlington, TX)
- …areas. Areas of special interest include, but are not limited to: (1) ** 3D Heterogeneous integration (3DHI):** electronic and photonic interconnect ... integration , chip-scale micro- and nano-systems, heterogeneous integration platforms including 2.5D and 3D . (2) **Photonic integrated circuits… more
- Mercury Systems (Phoenix, AZ)
- …Ability to obtain a DoD Secret Clearance Preferred Qualifications: * Package design of 3D devices, heterogeneous integration , System in Package (SiP) design ... lead and mentor engineers responsible for electrical design engineering of our advanced 2D/2.5D/ 3D packaging solutions. You will proactively identify problems… more
- Meta (Sunnyvale, CA)
- …Perform design analysis and what-if scenarios for novel packaging schemes such as 2.5D/ 3D and heterogeneous integration to improve bandwidth, power ... Silicon Packaging Design Engineer Responsibilities: 1. Perform package design for advanced custom silicon comprising single-chip/multi-chip and 3D or wafer… more
- Micron Technology, Inc. (Dallas, TX)
- …Micron's HBM product portfolio. In HBM HIG (High Bandwidth Memory - Heterogeneous Integration Group), we innovate and integrate end-to-end groundbreaking ... , high-speed interface design, high-performance computing architectures, and 2.5D & 3D package integration to understand and analyze bottlenecks and… more
- Micross Components (Research Triangle Park, NC)
- …an experienced Business Development person to help grow its Wafer Level Packaging and 3D Heterogeneous Integration (3DHI) product lines with a focus on ... pre-selling the 200-300mm wafer processing capacity coming online in late 2025 at the Research Triangle Park, NC facility. This position will serve primarily as an outward facing Business Development person identifying and developing opportunities with… more