• 3D Heterogeneous Integration

    Global Foundries (Malta, NY)
    …to network with executives. Summary of Role: Intern engineering student to contribute to 3D Advanced Heterogeneous Integration Development which includes ... verbal communication skills + Strong planning & organizational skills + Any Advanced Semiconductor Packaging or Semiconductor Integration experience a big plus… more
    Global Foundries (08/28/24)
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  • 3D Heterogenous Integration Engineer…

    Global Foundries (Malta, NY)
    …which give our new team members life-long connections and skills.​ Summary of Role: 3D Advanced Heterogeneous Integration Development Engineer which ... the tools & materials for the Malta Fab 8 Advanced Semiconductor fab and Fishkill PDL (Packaging Differentiation Line)....develop new wafer level and die level 2.5D and 3D Heterogeneous Integration processes. +… more
    Global Foundries (09/14/24)
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  • Senior Electronic Packaging Engineer

    The Boeing Company (Tukwila, WA)
    …techniques. This includes conventional packaging techniques like ASIC, BGA, 2.5D / 3D heterogeneous integration , and familiarity with commonly available ... + 5+ years of experience in the field of microelectronics packaging including MCM, heterogeneous integration , 3D chip stacking, etc + Experience with complex… more
    The Boeing Company (09/02/24)
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  • Silicon Packaging Design Engineer

    Meta (Sunnyvale, CA)
    …Perform design analysis and what-if scenarios for novel packaging schemes such as 2.5D/ 3D and heterogeneous integration to improve bandwidth, power ... Silicon Packaging Design Engineer Responsibilities: 1. Perform package design for advanced custom silicon comprising single-chip/multi-chip and 3D or wafer… more
    Meta (08/21/24)
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  • Distinguished Member of Technical Staff OR Fellow…

    Micron Technology, Inc. (Folsom, CA)
    …Micron Technology, Inc. has redefined innovation with the world's most advanced memory and semiconductor technologies. We're an international team of visionaries ... domain experts across platforms, systems architecture, component design, and advanced packaging, you'll analyze platform architecture trade-offs in close… more
    Micron Technology, Inc. (07/10/24)
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  • Product Line Manager

    Micross Components (Research Triangle Park, NC)
    …is seeking an experienced Sales person to help grow its Wafer Level Packaging and 3D Heterogeneous Integration (3DHI) product lines at its Research Triangle ... Park, NC facility. This position will serve primarily as an outward facing Sales person identifying and developing opportunities with existing and potential clients in support of the Inside Sales/Business Development Team and with assistance from the Micross… more
    Micross Components (08/06/24)
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