- Global Foundries (Malta, NY)
- …give our new team members life-long connections and skills. Summary of Role: 3D Advanced Heterogeneous Integration Development Engineer which includes wafer ... Test) to develop new wafer level and die level 2.5D and 3D Heterogeneous Integration processes. + Develop expertise in the processes, materials and tooling… more
- SpaceX (Bastrop, TX)
- …experience with microelectronics packaging development + Familiarity with 2D, 2.5D, and/or 3D packaging integration + Packaging familiarity with flip-chip, BGA, ... Principal IC Packaging Engineer , Silicon Technology (Starlink) at SpaceX Bastrop, TX...system-in-package SiP, multi-chip modules MCM, wirebond, panel level packaging, heterogenous and chiplet integration + Hands-on packaging,… more
- Micron Technology, Inc. (Boise, ID)
- …cost-effective producer of DRAM memory. In HBM HIG (High Bandwidth Memory, Heterogenous Integration Group), we innovate and integrate end-to-end groundbreaking ... faster than ever. **Micron Technology is searching for its next Product Pathfinding Engineer on the High Bandwidth Memory (HBM) technology team!** In this role you… more