- Mercury Systems (Phoenix, AZ)
- …and routine electronic assembly operations on components or subassemblies * Technical Knowledge of Die attach, Wire bond , Epoxy Dispense, Flipchip, Wafer ... electronic assembly operations on components or subassemblies * Technical Knowledge of Die attach, Wire bond , Epoxy Dispense, Flipchip, Wafer Die Eject,… more
- Micross Components (Apopka, FL)
- …to packages, set up and program wire bond machines, and wire bond die to packages according to build prints, complying with instructions and ... involving the making of minor decisions. Must have strong wire bond experience with an understanding of...for specjfic epoxy being used. Cure epoxy. + Attach die to package per build print. + Plasma clean… more
- Neotech (Chatsworth, CA)
- …an acceptable epoxy placement, die attach assembly, sub attached assembly and wire bond and ribbon bonds on a microelectronic device, in conformance with ... Summary: Operation of automatic and/or manual wire bond equipment in a clean-room environment, to manufacture high-reliability microelectronic devices. Essential… more
- Power Device Corp (Poway, CA)
- …setup and operation of Wire Bonding on highly complex products using advanced wire bond equipment. + Performs equipment setup and operation of wire ... the procedures involved with assembly of microelectronics using advanced die attach, and wire bonding equipment. Working...bond pull on highly complex products using advanced wire bond pull test equipment. + Cross… more
- L3Harris (Mason, OH)
- …maintenance and a development engineering teams. This particular role is for the wire bond /assembly area for Focal Plane Arrays Essential Functions: + Qualify, ... Semiconductor Process Engineer, you will support a variety of wafer/ die fabrication tools and processes, perform data analysis for...setup, and operate semiconductor wire bond equipment in a low volume… more
- Teledyne (Mountain View, CA)
- …This person will be responsible for but not limited to: + Perform wedge bond gold wire on modules and top-level assemblies per MIL-STD-883 specifications. + ... Perform ball bond gold wire on modules and top-level...Pull, destruct, and non-destruct per MIL-STD-883 specifications. + Perform die shear per MIL-STD-883 specifications. + Perform die… more
- Micross Components (Apopka, FL)
- …standards a plus. + Knowledge of Mil-STD-883 / Mil-STD-750 in test methods with related equipment ( wire bond , die attach, & furnace) a plus. + Knowledge or ... experience with Automatic assembly equipment for Wire bond , Die attach a plus + Knowledge in semiconductor manufacturing a plus. + Self-motivated with the… more
- Teledyne (Hawthorne, CA)
- …and Responsibilities** + Setup and operate automatic and/or manual bonding machines that bond gold and aluminum wire to integrated circuit dies to connect ... a variety of other related equipment, including high-powered microscopes, Dage wire pull and die shear equipment with speed and accuracy + Operate cleaning and… more
- Northrop Grumman (Linthicum, MD)
- …supports heat dissipation, and facilitates electrical connection to the outside world. + Wire Bond : Creating an electrical connection to the external environment ... and sent to tooling that cuts the mounted wafer into per-determined die size. + Die Sort: Picking pre selected discrete semiconductor devices from a diced wafer… more
- NY CREATES (Rochester, NY)
- …assembly equipment which may include photolithography, wafer bumping, singulation, pick & place, die attach, wire bond , flip chip, underfill and solder ... Diagnose failures using various characterization, test and analytical instruments including die shear, wire -pull, X-ray and CSAM. + Work inside the clean room… more
- Teledyne (Mountain View, CA)
- …efficiency and yield. + Assists in new product development with emphasis in auto wire -bonding and auto die attach. + Lead the transfer of processes, process ... assembly and test or related filed. + Preferred background in electronics assembly ( wire bonding, die /component attach) and processes. + Preferred knowledge and… more
- Skyworks (Newbury Park, CA)
- …package grinder and X-ray machine. + Read and interpret schematics, engineering and wire bond drawings. + Ability to communicate and interact with internal ... parts using assembly equipment such as Fuji SMT, Datacon Die attach, K&S Wirebond, TOWA Mold, EO Technics Laser...the following semiconductor assembly equipment: + Fuji SMT DATACON Die Attach, K&S Wirebonder, TOWA Mold, EO Technics Laser… more
- SpaceX (Bastrop, TX)
- …characterization techniques and equipment, including but not limited to: mechanical testing (ie, wire bond , die shear and peel testing), electrical testing ... testing of electronic materials such as thermal interface materials, underfill, die attach adhesives, wafer bonding, molding compounds, PCB prepregs, PCB surface… more
- Skyworks (San Jose, CA)
- …should have extensive hands-on experience with assembly, soldering fine pitch components, wire bond rework, manual flip chip assembly, precision rework on ... rework applications. * Conduct inspection and rework on PCBs, flip chips, die swaps, manual wire bonds, and 0201 / 01005 component changes under a microscope. *… more
- Skyworks (Newbury Park, CA)
- …Saw Singulation, back grinder and X ray machines. Read and interpret schematics, wire bond , and engineering drawings. Ability to communicate and interact with ... to operate and set up any of the following semiconductor assembly equipment: Fuji SMT, DATACON Die Attach, K&S Wire bonder, TOWA Mold, EO Technics Laser marking,… more
- Daktronics (Brookings, SD)
- …processes, evaluate materials, and test product designs. The labs consist of die bonders, micro-LED mass transfer printers, spin coaters, plasma etch, curing ... systems, bond tester, encapsulant machine, and analysis tools. This is...to perform the job functions. + Distinguish and identify wire colors. + Work with odors (solder/paint/solvent/manufacturing odors). +… more
- RTX Corporation (Andover, MA)
- …and understanding of electrical schematics, circuit analysis, digital processing, RF analysis, die level analysis, and the materials of electrical components (metal ... wire bonding, substrates, solder, adhesives, & encapsulants). The devices...testers, megohmmeters, laser millers, plasma etchers, chemical jet etchers, bond puller, etc. In addition, this role requires researching,… more
- RTX Corporation (Andover, MA)
- …and understanding of electrical schematics, circuit analysis, digital processing, RF analysis, die level analysis, and the materials of electrical components (metal ... wire bonding, substrates, solder, adhesives, & encapsulants). The devices...testers, megohmmeters, laser millers, plasma etchers, chemical jet etchers, bond puller, etc. + Researching, investigating, and experimenting with… more