• Principal IC Packaging

    SpaceX (Bastrop, TX)
    Principal IC Packaging Test Engineer, Silicon Technology (Starlink) at SpaceX Bastrop, TX SpaceX was founded under the belief that a future where ... make this possible, with the ultimate goal of enabling human life on Mars. PRINCIPAL IC PACKAGING TEST ENGINEER, SILICON TECHNOLOGY (STARLINK) SpaceX is… more
    SpaceX (10/27/24)
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  • Principal IC Packaging

    SpaceX (Bastrop, TX)
    Principal IC Packaging Engineer,...reliable internet to 4M+ users worldwide. We design, build, test , and operate all parts of the system - ... the ultimate goal of enabling human life on Mars. PRINCIPAL IC PACKAGING ENGINEER, SILICON...SMT assembly experience + OSAT (outsource semiconductor assembly and test ) experience a plus COMPENSATION AND BENEFITS: Pay Range:… more
    SpaceX (10/27/24)
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  • Principal IC Design Engineer

    Cirtec Medical (Chandler, AZ)
    Principal IC Design Engineer Department: Engineering Location:...+ Act as a Subject Matter Expert (SME) in IC design circuits and principles + Test bench ... to bring medical devices to the market quickly, predictably, and cost-effectively. The Principal Engineer, Integrated Circuit ( IC ) Design is based out of our… more
    Cirtec Medical (09/05/24)
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  • Principal Mixed Signal IC Design…

    RTX Corporation (Raleigh, NC)
    …problems that create a safer, more secure world. An exciting opportunity exists for a Principal Mixed Signal IC Design Engineer to join our strong team. In this ... teams including chip architecture, specification, design, verification, validation, fabrication, packaging , debugging, test development, failure analysis, and… more
    RTX Corporation (10/26/24)
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  • Digital IC Design Principal Engineer

    RTX Corporation (Goleta, CA)
    …teams, including chip architecture, specification, design, verification, validation, fabrication, packaging , debugging, test development, failure analysis, and ... documentation. You will work to develop new digital block level microarchitectures, plan work breakdown structures and tasking, design digital logic blocks using Verilog and SystemVerilog HDL and utilize in-house digital IPs to extend functionality and/or to… more
    RTX Corporation (09/11/24)
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  • Principal Packaging Engineer

    Skyworks (Austin, TX)
    Principal Packaging Engineer Apply now " Date:Oct 1, 2024 Location: Austin, TX, US Company: Skyworks If you are looking for a challenging and exciting career in ... solder attach, die attach, wire-bonding, over-molding, materials curing, BGA, etc. * Experience in IC packaging as defined in JEDEC, IATF and AEC standards. *… more
    Skyworks (10/02/24)
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  • Principal /Sr. Principal RF MMIC…

    Northrop Grumman (Linthicum, MD)
    …failure analysis, the NGMC is a leader in designing, fabricating, packaging , and delivering discriminating microelectronics to the military, aerospace, and ... and large-scale high-performance computing systems. MDA is seeking a ** Principal / Senior Principal RF MMIC Design...chip-level integration. + Proficiency with Cadence Virtuoso or similar IC design software. + Working knowledge of the … more
    Northrop Grumman (10/21/24)
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  • Principal RF Engineer / Sr.…

    Northrop Grumman (Linthicum, MD)
    …Digital hardware designs + Collaborating with peer functions such as Mechanical, Manufacturing, Test , and IC design Engineers + Deriving and trading requirements ... MD. This position will be filled at either the Principal RF Engineer or Sr. Principal RF...requirements, and schematic drawings + Hands on experience utilizing test instrumentation such and power supplies, network analyzers, Oscilloscopes,… more
    Northrop Grumman (10/13/24)
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  • Principal or Sr. Principal RF…

    Northrop Grumman (Mcclellan, CA)
    …and digital hardware designs + Collaborate with peer functions in Mechanical, Manufacturing, Test , and IC design engineering + Derive and trade requirements with ... assembly-level requirements This position may be filled as a Principal RF Modeling and Simulation Engineer OR Sr. ...versed in working with Ansys HFSS modeling for RF packaging effects. + Experience with spectrum and network analyzer… more
    Northrop Grumman (10/12/24)
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  • Senior Principal Radiation Assurance…

    BAE Systems (Manassas, VA)
    …of missions. We are seeking a highly skilled and experienced radiation assurance and packaging engineer to join our team in Manassas, VA. The ideal candidate should ... board design, package design, high frequency digital technologies, mixed signal IC technologies, and electrical testing of RF and digital circuits.… more
    BAE Systems (08/14/24)
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  • Sr. Principal Electrical Engineer - Analog…

    Skyworks (Andover, MA)
    …including PVT simulations * Work with cross-functional teams from Foundry engineering, packaging , and test to realize advance prototypes. * Support development ... Sr. Principal Electrical Engineer - Analog Design Lead Apply...the needs of Connectivity products and define applicable analog test vehicles for development * Engage in all aspects… more
    Skyworks (09/13/24)
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  • Principal Fiber Optics Hardware Systems…

    Lightmatter (Mountain View, CA)
    …You will work closely with our hardware and software teams, including mechanical, packaging , and IC engineering, to design and build leading-edge system-level ... optimization in collaboration with other groups. + Develop cable test plans, analyze the data, and create test... test plans, analyze the data, and create test reports. + Provide technical leadership of the System… more
    Lightmatter (10/04/24)
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  • FAST Labs - Program Engineering Manager II…

    BAE Systems (Merrimack, NH)
    test , production test , and qualification + Deep understanding of the full IC development process, including IC packaging approaches and wafer, die, ... partnerships and collaborate across a broad innovation ecosystem that includes DoD/ IC /OGA labs and research teams, universities, small businesses, and venture… more
    BAE Systems (10/12/24)
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