- Micross Components (Durham, NC)
- …This position will support the Micross 3D Heterogeneous Integration program areas, including: + Development of semiconductor advanced packaging processes ... and technologies + 2.5/ 3D integration : TSV processing, wafer thinning &...engineering staff are to support Program Managers and technology development projects in the form of day-to-day project management… more
- Micross Components (Research Triangle Park, NC)
- …experienced Business Development person to help grow its Wafer Level Packaging and 3D Heterogeneous Integration (3DHI) product lines with a focus on ... This position will serve primarily as an outward facing Business Development person identifying and developing opportunities with existing and potential clients… more